AGIB027R29A2E2VR3

$31,397.52

Description：IC FPGA AGILEX-I 2957FBGA
Series：Agilex I

SKU:a97e07a29bc3 Category: System On Chip (SoC) Brand: Altera

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Product introduction

AGIB027R29A2E2VR3 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-I 2957FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGIB027R29A2E2VR3

Description：IC FPGA AGILEX-I 2957FBGA
Series：Agilex I
Mfr：Altera
Package：Tray
Architecture：MPU, FPGA
Core Processor：Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size：-
RAM Size：256KB
Peripherals：DMA, WDT
Connectivity：EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed：1.4GHz
Primary Attributes：FPGA - 2.7M Logic Elements
Operating Temperature：0°C ~ 100°C (TJ)
Grade：-
Qualification：-
Package / Case：-
Supplier Device Package：-

Soc System On Chip datasheet and documents for AGIB027R29A2E2VR3

AGIB027R29A2E2VR3

Soc System On Chip Overview

The Altera AGIB027R29A2E2VR3 is a System on Chip (SoC) integrated circuit belonging to the Agilex I series. It integrates an FPGA fabric with 2.7 million logic elements and a quad-core ARM Cortex-A53 MPCore processor running at 1.4 GHz. The device features 256 KB of embedded RAM, supports up to 720 I/Os, and utilizes a 2957-ball FBGA package measuring 56x45 mm. Operating temperatures range from 0°C to 100°C TJ.

Soc System On Chip Feature Summary

Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debug support and floating-point capabilities alongside an FPGA fabric.

Soc System On Chip Applications

High-performance embedded computing systems requiring combined processing and programmable logic.

Soc System On Chip Procurement Notes

Verify the specific suffix 'R3' against official Intel/Altera documentation to confirm reel packaging specifications and any associated marking changes. Ensure compatibility with existing board designs by cross-referencing pinouts and thermal requirements in the latest Agilex I datasheet before procurement.

Soc System On Chip Selection Notes

Select this component when a high-density Agilex I SoC with 2.7M LEs and a 1.4 GHz ARM core is required. Confirm that the 2957-BGA footprint and 720 I/O count meet the target PCB layout constraints and that the 0-100°C operating temperature aligns with environmental conditions.

Soc System On Chip Part Context

This part belongs to the Agilex I family, designed for applications demanding high performance and low power consumption. It combines the flexibility of FPGA logic with the efficiency of ARM processors, targeting complex embedded systems and industrial applications.