AGIB027R31A2I1V

Soc System On Chip Overview

The AGIB027R31A2I1V is an Agilex I Series System on Chip (SoC) integrated circuit manufactured by Altera. It integrates a Field Programmable Gate Array with 2.7 million logic elements and a quad-core ARM Cortex-A53 processor running at 1.4 GHz. The device features 256 KB of RAM, 720 I/Os, and supports interfaces including Ethernet, USB OTG, SPI, and UART. It operates within a junction temperature range of 0°C to 100°C and is housed in a 3184-BGA package measuring 56x45 mm.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debug capabilities and floating-point support alongside FPGA fabric.

Soc System On Chip Applications

• Embedded systems requiring combined processing and programmable logic
• Industrial automation controllers
• Network infrastructure equipment

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating compliance against official datasheets. Confirm package dimensions and pinout compatibility during integration planning. Check for recent Product Change Notifications regarding labeling or material updates before finalizing procurement specifications.

Soc System On Chip Selection Notes

Select this model when 2.7M logic elements and 1.4GHz ARM processing are required. Ensure the design accommodates the 3184-BGA footprint and 56x45mm dimensions. Verify that the 0°C to 100°C operating range meets environmental requirements compared to commercial variants.

Soc System On Chip Part Context

This component belongs to the Agilex I series, specifically the AGI027 subgroup. It shares architectural similarities with other Agilex I SoCs but is distinguished by its 2.7M logic element count and specific processor configuration. It serves as a high-performance solution for complex embedded applications.

Soc System On Chip Replacement Considerations

AGIB027R31A2E1V: Commercial temperature variant. AGIB027R31A2E3V: Extended temperature variant. Verify suffix differences strictly against manufacturer documentation to ensure thermal and functional equivalence.