AGID019R18A1E2V

Overview

The Altera AGID019R18A1E2V is an Agilex I System on Chip FPGA featuring a 1.9M logic element capacity and a quad-core ARM Cortex-A53 processor running at 1.4GHz. It integrates 256KB of RAM, 480 I/Os, and supports interfaces including Ethernet, USB OTG, SPI, and UART. The device operates within a junction temperature range of 0°C to 100°C and is housed in a 1805-BGA package measuring 42.5x42.5 mm.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore with CoreSight for embedded processing
• Provides 1.9M logic elements for configurable hardware acceleration
• Supports diverse connectivity via Ethernet, USB OTG, and standard serial interfaces

Applications

• Industrial automation controllers requiring real-time processing
• Network infrastructure equipment utilizing integrated Ethernet capabilities
• Embedded systems needing combined FPGA flexibility and ARM processing

Procurement Notes

Verify the specific suffix E2V against official datasheets to confirm the commercial temperature grade (0°C to 100°C). Ensure compatibility with the 1805-BGA footprint dimensions of 42.5x42.5 mm during PCB layout. Confirm moisture sensitivity level 3 handling requirements are met for storage and assembly processes.

Selection Notes

Select this model when a commercial temperature range is sufficient for the application environment. The 1.9M logic count suits moderate complexity designs. Verify that the 1.4GHz processor speed meets timing constraints for the embedded software workload before finalizing the component choice.

Part Context

This part belongs to the Agilex I series, designed for mid-range performance applications. It combines Intel's FPGA fabric with ARM processor cores. The designation indicates specific packaging and thermal characteristics distinct from industrial or extended temperature variants within the same family.

Replacement Considerations

AGIB019R18A1E2V offers identical electrical specifications but may differ in marking or label updates. Cross-reference pinouts and thermal pads to ensure mechanical compatibility without redesigning the carrier board.