AGID019R18A1I2VB

AGID019R18A1I2VB

$30,155.57
  • Description:AGID019R18A1I2VB
  • Series:Agilex I

SKU:f79fd7b9b710 Category: Brand:

  
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Product Detailed Parameters

  • Description:AGID019R18A1I2VB
  • Series:Agilex I
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1805-BBGA Exposed Pad
  • Supplier Device Package:1805-BGA (42.5x42.5)

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AGID019R18A1I2VB

Overview

The Altera AGID019R18A1I2VB is an Agilex I System on Chip (SoC) integrated circuit featuring a Field Programmable Gate Array with 1.9 million logic elements. It integrates a quad-core ARM Cortex-A53 MPCore processor equipped with CoreSight, ARM NEON, and floating-point capabilities. The device operates at a speed of 1.4GHz and includes 256KB of RAM. It provides 480 input/output pins within a 1805-BBGA bare pad package measuring 42.5x42.5 mm. The component supports an operating junction temperature range of -40°C to 100°C.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight, ARM NEON, and floating-point units for embedded processing tasks.
  • Provides 1.9 million logic elements in the FPGA fabric for customizable hardware acceleration and digital logic implementation.
  • Supports diverse connectivity interfaces including Ethernet, USB OTG, SPI, UART/USART, I2C, and MMC/SD/SDIO.

Applications

  • Industrial automation controllers requiring real-time processing and programmable logic
  • Telecommunications infrastructure equipment utilizing high-speed serial interfaces
  • Embedded systems integrating ARM processing cores with FPGA reconfigurability

Procurement Notes

Verify the specific suffix 'VB' against official manufacturer documentation to confirm exact package marking and revision status. Confirm that the 1805-BBGA bare pad package requires appropriate surface mount assembly processes. Ensure compatibility with the Agilex I design ecosystem tools before procurement.

Selection Notes

Select this model when a combination of 1.9M logic elements and a quad-core ARM Cortex-A53 processor is required. Verify that the -40°C to 100°C industrial temperature range meets environmental specifications. Confirm that the 1805-ball BGA footprint fits the target PCB layout constraints.

Part Context

This part belongs to the Agilex I series, which combines ARM processors with FPGA technology. It shares core architectural features with other Agilex I variants such as AGID019R18A2I2VB, differing primarily in suffix designations related to package or revision details. The series targets applications needing both software flexibility and hardware configurability.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult official distributor databases for cross-references based on pinout and electrical equivalence.

AGID019R18A1I2VBAGID019R18A1I2VB
$30,155.57
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