AGID019R31B2E1VB

Overview

The AGID019R31B2E1VB is an Agilex 7 I-Series FPGA SoC manufactured by Altera. It features a hard processor system with a quad-core ARM Cortex-A53 MPCore and integrates approximately 1.9 million logic elements. The device utilizes a 3184-ball IBGA package measuring 56x45 mm. It supports operating junction temperatures ranging from -40°C to 100°C and includes peripherals such as DMA and WDT. Connectivity options encompass Ethernet, USB OTG, SPI, UART, and MMC/SD interfaces.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 processor with CoreSight debug capabilities
• Provides high-density programmable logic resources within a compact BGA footprint
• Supports multiple high-speed serial communication protocols including Ethernet and USB

Applications

• Wireless infrastructure equipment
• Industrial automation controllers
• Automotive infotainment systems

Procurement Notes

Verify the specific suffix 'B2' against official datasheets to confirm temperature grade and speed bin accuracy. Ensure compatibility with Agilex 7 design tools and check for any recent package label changes or known issues listed in the latest errata documents before finalizing procurement specifications.

Selection Notes

Select this model when requiring integrated processing power alongside substantial FPGA fabric density. Compare against the C-series variants if industrial temperature ranges are not required. Validate that the 3184-ball package fits the target PCB layout constraints and thermal management requirements for the intended application environment.

Part Context

This component belongs to the Agilex 7 I-Series family, designed for cost-optimized designs requiring significant logic capacity. It shares architectural similarities with other Agilex devices but offers specific integration levels of ARM processors and transceivers tailored for mid-to-high performance embedded applications.

Replacement Considerations

Direct substitutes may include other Agilex 7 I-Series parts with equivalent logic counts and package types. Verify pin-to-pin compatibility and electrical specifications before swapping. Consult the Agilex migration guides for detailed comparison matrices between different density tiers within the same series.