SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AGL250V2-FGG144I is a Microchip Technology IGLOO FPGA utilizing a 130-nm flash process. It provides 250,000 system gates and 6,144 VersaTiles within a 144-pin Fine Pitch Ball Grid Array (FGG144) package. The device supports a core voltage range of 1.2 V to 1.5 V and operates across an industrial temperature range of -40°C to +85°C. It features 97 user I/Os, 36 kbits of embedded SRAM, and 1 kbit of FlashROM. Key capabilities include Flash*Freeze technology for ultra-low power retention, Instant On functionality, and AES-protected in-system programming.
Verify the specific ordering suffix against official documentation to confirm temperature grade and packaging compliance. Ensure that the selected variant matches the required junction temperature range and lead-free specifications for the target application environment.
Select this component when a single-chip solution with nonvolatile configuration and reprogrammability is required. Consider the 250,000 gate capacity and 97 I/O count for moderate complexity logic designs. Verify compatibility with existing design tools and ensure the FG144 package dimensions fit the board layout constraints.
This part belongs to the IGLOO family of low-power flash FPGAs. It shares architectural similarities with other AGL250 variants but differs in package type and temperature rating. The 'V2' designation indicates support for a wide core voltage range, distinguishing it from fixed-voltage versions.
Direct pin-compatible replacements within the same package exist among other AGL250 series devices. Verify logic density and I/O availability when substituting with higher or lower density parts in the IGLOO family.