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The AGL400V2-FG144I is a flash-based Field Programmable Gate Array (FPGA) from the IGLOO family, manufactured by Microsemi. It features 400,000 system gates and 9,216 configurable logic blocks (VersaTiles). The device operates within a core voltage range of 1.14 V to 1.575 V and supports an industrial temperature range of -40°C to +100°C. It utilizes a 130-nm CMOS process with seven metal layers and is housed in a 144-pin Fine Pitch Ball Grid Array (FG144) package measuring 13 mm x 13 mm with a 1.0 mm pitch.
Verify the specific ordering suffixes against official Microsemi documentation to confirm package type, temperature grade, and RoHS compliance status. Ensure that design files match the exact part number variant, as suffixes indicate distinct manufacturing specifications. Cross-reference datasheet revision dates to confirm feature availability and pinout definitions.
Select this device for designs requiring nonvolatile configuration and instant-on functionality. Consider the 400,000 gate capacity and VersaTile architecture for complex logic implementations. Evaluate the FG144 package dimensions against PCB space constraints. Confirm that the required I/O voltage levels align with the bank-selectable capabilities of the device.
This component belongs to the IGLOO Low Power Flash FPGA family. It shares architectural similarities with other devices in the series, such as the AGL250 and AGL600, but offers a specific balance of logic density and I/O count. The V2 designation indicates support for a wide core voltage range compared to earlier single-voltage variants.
Devices within the same IGLOO family may offer pin-compatible alternatives. Verify functional equivalence regarding gate counts, memory resources, and I/O configurations before substitution. Consult the manufacturer's migration guide for design rule adjustments when moving between different density levels or package types.