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The AGL400V2-FGG144I is a flash-based Field Programmable Gate Array from the IGLOO family, manufactured by Microsemi. It features 400,000 system gates and 9,216 VersaTiles (D-flip-flops). The device operates with a core voltage range of 1.2 V to 1.5 V and supports an industrial temperature range of –40°C to +100°C. It is housed in a 144-pin Fine Pitch Ball Grid Array (FG144) package with a 1.0 mm pitch. Key specifications include up to 54 kbits of true dual-port SRAM, 1 kbit of FlashROM, and support for AES-protected In-System Programming.
Verify the specific ordering suffix 'I' confirms the industrial temperature grade (-40°C to +100°C) and 'G' indicates RoHS-compliant packaging. Confirm that the '2' suffix denotes the V2 core voltage range (1.2 V to 1.5 V). Ensure compatibility with existing FG144 footprints if migrating from other density levels within the IGLOO family.
Select this device for designs requiring 400,000 system gates with industrial temperature ratings. Compare against lower-density parts like AGL250 or higher-density parts like AGL600 based on gate count and pin availability requirements. Verify that the 144-pin package provides sufficient user I/Os for the interface needs, noting that differential pairs reduce single-ended I/O counts.
This component belongs to the IGLOO Low Power Flash FPGA family, which utilizes a 130-nm process. The AGL400 variant sits between the AGL250 and AGL600 in terms of logic capacity. It shares architectural similarities with other IGLOO devices, including VersaTile logic blocks and CCCs, but offers a specific balance of resources for mid-range applications.
Pin-compatible alternatives within the same package include AGL250V2-FGG144I (lower density) and AGL600V2-FGG144I (higher density). Ensure that the replacement part meets the required gate count and I/O constraints. Note that ARM-enabled variants (M1AGL) are not direct functional replacements due to different architecture and lack of AES support.