AGL400V2-FGG144I

AGL400V2-FGG144I

$32.74
  • Description:IC FPGA 97 I/O 144FBGA
  • Series:IGLOO

SKU:d1872555816f Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 97 I/O 144FBGA
  • Series:IGLOO
  • Mfr:Microsemi Corporation
  • Package:Tray
  • Number of Logic Elements/Cells:9216
  • Total RAM Bits:55296
  • Number of I/O:97
  • Voltage - Supply:1.14V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Package / Case:144-LBGA
  • Supplier Device Package:144-FPBGA (13x13)
  • Number of Gates:400000

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AGL400V2-FGG144I

Overview

The AGL400V2-FGG144I is a flash-based Field Programmable Gate Array from the IGLOO family, manufactured by Microsemi. It features 400,000 system gates and 9,216 VersaTiles (D-flip-flops). The device operates with a core voltage range of 1.2 V to 1.5 V and supports an industrial temperature range of –40°C to +100°C. It is housed in a 144-pin Fine Pitch Ball Grid Array (FG144) package with a 1.0 mm pitch. Key specifications include up to 54 kbits of true dual-port SRAM, 1 kbit of FlashROM, and support for AES-protected In-System Programming.

Feature Summary

  • Flash*Freeze technology enables ultra-low power consumption while retaining FPGA content without requiring external components.
  • Instant On Level 0 support allows immediate operation upon power-up without external configuration memory.
  • Integrated security features include FlashLock and 128-bit AES decryption for intellectual property protection.
  • Advanced I/O structure supports mixed-voltage operation across multiple banks with programmable slew rates.

Applications

  • Portable electronics requiring low static power consumption
  • Secure remote field updates via encrypted ISP
  • Systems needing instant-on functionality without boot PROMs

Procurement Notes

Verify the specific ordering suffix 'I' confirms the industrial temperature grade (-40°C to +100°C) and 'G' indicates RoHS-compliant packaging. Confirm that the '2' suffix denotes the V2 core voltage range (1.2 V to 1.5 V). Ensure compatibility with existing FG144 footprints if migrating from other density levels within the IGLOO family.

Selection Notes

Select this device for designs requiring 400,000 system gates with industrial temperature ratings. Compare against lower-density parts like AGL250 or higher-density parts like AGL600 based on gate count and pin availability requirements. Verify that the 144-pin package provides sufficient user I/Os for the interface needs, noting that differential pairs reduce single-ended I/O counts.

Part Context

This component belongs to the IGLOO Low Power Flash FPGA family, which utilizes a 130-nm process. The AGL400 variant sits between the AGL250 and AGL600 in terms of logic capacity. It shares architectural similarities with other IGLOO devices, including VersaTile logic blocks and CCCs, but offers a specific balance of resources for mid-range applications.

Replacement Considerations

Pin-compatible alternatives within the same package include AGL250V2-FGG144I (lower density) and AGL600V2-FGG144I (higher density). Ensure that the replacement part meets the required gate count and I/O constraints. Note that ARM-enabled variants (M1AGL) are not direct functional replacements due to different architecture and lack of AES support.

AGL400V2-FGG144IAGL400V2-FGG144I
$32.74
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