SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AGL400V2-FGG484I is a Field Programmable Gate Array from the Microsemi IGLOO family, utilizing a 130-nm flash-based CMOS process. It provides 400,000 system gates and 9,216 VersaTiles (D-flip-flops). The device features 54 kbits of embedded RAM organized into twelve 4,608-bit blocks and includes one integrated PLL within its Clock Conditioning Circuits. Operating at a maximum frequency of 250 MHz in 1.5 V systems or 160 MHz in 1.2 V systems, it supports mixed-voltage I/O standards ranging from 1.2 V to 3.3 V. The component is housed in a 484-ball Fine Pitch Ball Grid Array package with a 1.0 mm pitch and operates within an industrial temperature range of -40°C to +100°C.
Verify that the specific ordering suffix matches the required voltage support and temperature grade. Confirm RoHS compliance status based on the packaging designation. Ensure the design toolchain supports the IGLOO V2 architecture and verify pin compatibility if migrating from other packages in the family.
Select this device when 400,000 system gates are sufficient for the logic density requirements. Consider the 1.2 V core voltage option for reduced power consumption compared to 1.5 V systems. Verify that the FG484 package footprint meets the PCB layout constraints and thermal requirements for the target application environment.
This component belongs to the IGLOO Low Power Flash FPGA family, which is characterized by nonvolatile flash technology and low power consumption. It is distinct from SRAM-based FPGAs due to its Instant On capability and lack of need for external boot PROMs. The AGL400 variant sits between the AGL250 and AGL600 in terms of logic capacity within the standard IGLOO lineup.
Devices such as AGL400V5-FGG484I offer similar logical resources but may differ in manufacturing revisions or specific feature sets like ARM processor support. Verify pinout compatibility and electrical characteristics before substitution.