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AOT10T60PL is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Alpha & Omega Semiconductor Inc.. Its product description is MOSFET N-CH 600V 10A TO220. Review the specifications below when checking this part for your BOM.
The AOT10T60PL is a 600V N-Channel MOSFET utilizing Trench Power AlphaMOS-II technology in a TO-220 package. It features a maximum drain-source voltage of 700V and continuous drain current of 10A at 25°C case temperature. The device offers a maximum on-resistance of 0.7Ω, typical gate charge of 26nC, and effective output capacitance energy of 3.5μJ at 400V. It supports a peak diode recovery dv/dt of 10V/ns and includes 100% UIS and Rg testing.
Verify the specific suffix PL indicates the Green Tube packaging format with a minimum order quantity of 1000 units. Confirm that the component is designed and qualified strictly for the consumer market. Ensure compliance with RoHS and Halogen Free standards as documented by the manufacturer. Do not utilize this part for life support devices or systems without explicit authorization from Alpha & Omega Semiconductor Inc.
Select this component when a 600V rated N-Channel MOSFET is required for general lighting or AC/DC power supply designs. The TO-220 package suits through-hole mounting requirements. Consider the 0.7Ω maximum on-resistance and 10A continuous current rating for thermal management planning. Verify compatibility with the specified operating temperature range of -55°C to 150°C for the intended application environment.
This part belongs to the AOT10T60P family, which includes variants in different packages such as TO-220F and TO-263 D2PAK. All variants share the same core electrical characteristics derived from the AlphaMOS-II technology. The AOT10T60PL specifically denotes the standard TO-220 configuration packaged in a green tube format.
Compatible substitutes within the same family include AOB10T60PL and AOTF10T60PL. These alternatives offer identical electrical specifications but differ in physical package type. Ensure the replacement package matches the PCB footprint and thermal dissipation requirements of the existing design.
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