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AOT260L is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Alpha & Omega Semiconductor Inc.. Its product description is MOSFET N-CH 60V 20A/140A TO220. Review the specifications below when checking this part for your BOM.
The AOT260L is a 60V N-Channel MOSFET utilizing Trench technology optimized for high-frequency switching. It features an extremely low RDS(ON) of less than 2.5mΩ at VGS=10V and 20A, and less than 2.9mΩ at VGS=6V. The device supports a continuous drain current of 140A at TC=25°C and includes a soft recovery body diode. It is designed for boost converters and synchronous rectifiers in consumer, telecom, industrial power supplies, and LED backlighting applications.
Verify the specific package variant required, as the datasheet covers both TO-220 (AOT260L) and TO-263/D2PAK (AOB260L). Confirm that the application environment aligns with the consumer market qualification stated in the documentation. Ensure thermal management designs account for the specified junction-to-case and junction-to-ambient thermal resistances under actual operating conditions.
Select this component for applications requiring low on-resistance and fast switching at 60V. Consider the TO-220 package for through-hole mounting or TO-263 for surface mount. Evaluate thermal dissipation requirements against the provided derating curves. Verify that the gate drive voltage meets the threshold for optimal RDS(ON) performance at either 6V or 10V.
The AOT260L belongs to Alpha & Omega Semiconductor's lineup of 60V N-Channel MOSFETs. It shares design similarities with the AOB260L, differing primarily in packaging. Both variants utilize the same underlying trench technology and electrical characteristics, offering flexibility for different board layout and assembly requirements while maintaining consistent switching performance.
The AOB260L serves as a direct functional equivalent with identical electrical specifications, differing only in the TO-263 surface-mount package instead of the TO-220 through-hole package. Substitution requires verifying footprint compatibility and thermal interface constraints.
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