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APL502J is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MOSFET N-CH 500V 52A ISOTOP. Review the specifications below when checking this part for your BOM.
The APL502J is a single N-channel linear power MOSFET manufactured by Microchip Technology. It features a 500V drain-source breakdown voltage and supports a continuous drain current of 52A at case temperature. The device exhibits a maximum on-resistance of 90 milliohms when driven at 12V with a 26A current. It operates within a junction temperature range of -55°C to +150°C and handles a maximum power dissipation of 568W. The component utilizes the ISOTOP package, providing electrical isolation between the drain and the mounting base.
Verify the specific suffix J against official Microchip documentation to confirm the ISOTOP package variant. Ensure that the ordering information matches the exact pinout and thermal characteristics required for the target design. Cross-reference the datasheet revision date to confirm compliance with current manufacturing standards and material declarations before finalizing procurement specifications.
Select this component when an electrically isolated high-power N-channel MOSFET is required for linear mode operation. The ISOTOP package facilitates direct heatsink mounting without additional insulators. Evaluate the thermal resistance and power dissipation limits relative to the expected operating current and ambient conditions to ensure reliable performance within the specified temperature range.
This device belongs to the APL502 series of linear power MOSFETs from Microchip Technology. The series offers various packages including T-MAX and SOT-227 variants to accommodate different thermal and mechanical constraints. The APL502J specifically denotes the version utilizing the ISOTOP technology for enhanced isolation capabilities in high-voltage power applications.
Direct substitutes include other APL502 series variants such as APL502B2G or APL502LPB, provided the package type and isolation requirements align with the design. Verify pin compatibility and thermal performance metrics before swapping components.
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