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APT2X60D40J
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Product Detailed Parameters
- Description：DIODE MODULE GP 400V 60A ISOTOP
- Series：-
- Mfr：Microchip Technology
- Package：Tube
- Diode Configuration：2 Independent
- Technology：Standard
- Voltage - DC Reverse (Vr) (Max)：400 V
- Current - Average Rectified (Io) (per Diode)：60A
- Voltage - Forward (Vf) (Max) @ If：1.5 V @ 60 A
- Speed：Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：37 ns
- Current - Reverse Leakage @ Vr：250 µA @ 400 V
- Operating Temperature - Junction：-
- Mounting Type：Chassis Mount
- Package / Case：SOT-227-4, miniBLOC
- Supplier Device Package：ISOTOP®
- Grade：-
- Qualification：-
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Overview
The APT2X60D40J is a discrete semiconductor module manufactured by Microchip Technology. It features a dual anti-parallel configuration of Fast Recovery Epitaxial Diodes (FRED) housed in an SOT-227 package. The component is rated for a maximum repetitive peak reverse voltage of 400 V and a continuous forward current of 60 A. Constructed using silicon technology, it supports screw mounting and operates within a junction temperature range of -55°C to +175°C.
Feature Summary
- Dual anti-parallel diode topology for bridge or freewheeling applications
- Fast recovery epitaxial diode construction for efficient switching
- High thermal stability with extended operating temperature range
Applications
- Industrial motor drives
- Uninterruptible power supplies
- DC-DC converters
Procurement Notes
Verify the specific suffix 'J' against the official Microchip datasheet to confirm pinout and mechanical dimensions match your design requirements. Ensure the ordering quantity aligns with the manufacturer's tube packaging specifications. Confirm RoHS compliance status through the latest product change notifications before finalizing procurement.
Selection Notes
Select this module when a compact dual-diode solution is required for 400V systems. The SOT-227 package facilitates direct heatsink mounting via screw terminals. Evaluate thermal resistance parameters relative to your cooling strategy to ensure the junction temperature remains within the specified +175°C limit under peak load conditions.
Part Context
This component belongs to Microchip's family of high-power discrete semiconductor modules. It utilizes silicon-based fast recovery technology designed for robust performance in power conversion circuits. The SOT-227 form factor provides a standardized interface for industrial power electronics, balancing current handling capabilities with manageable physical footprint constraints.
Replacement Considerations
Consult the official Microchip cross-reference documentation for verified substitutes. Generic equivalents may not match the specific reverse recovery time or thermal characteristics of the original FRED structure.
