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Product Detailed Parameters
- Description:DIODE STANDARD 400V 30A D3PAK
- Series:-
- Mfr:Microchip Technology
- Package:Tube
- Technology:Standard
- Voltage - DC Reverse (Vr) (Max):400 V
- Current - Average Rectified (Io):30A
- Voltage - Forward (Vf) (Max) @ If:1.5 V @ 30 A
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):32 ns
- Current - Reverse Leakage @ Vr:250 µA @ 400 V
- Capacitance @ Vr, F:-
- Mounting Type:Surface Mount
- Package / Case:TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
- Supplier Device Package:D3PAK
- Operating Temperature - Junction:-55°C ~ 175°C
- Grade:-
- Qualification:-
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Overview
The APT30D40SG is a Fast Recovery Epitaxial Diode (FRED) manufactured by Microchip Technology. It features a 400 V reverse voltage rating and a 30 A forward current capacity. The device utilizes a D3PAK surface-mount package for efficient thermal management. Key electrical parameters include a 22 ns recovery time, a maximum forward voltage of 1.3 V, and a peak repetitive reverse voltage of 400 V. It operates within a junction temperature range of -55 °C to +175 °C.
Feature Summary
- Fast recovery epitaxial diode technology for high-speed switching applications
- Surface-mount D3PAK package design for automated assembly and thermal efficiency
- High-temperature operation capability up to 175 °C junction temperature
Applications
- High-frequency power supply circuits
- Motor drive systems requiring fast rectification
- Uninterruptible power supply (UPS) inverters
Procurement Notes
Verify the specific suffix 'SG' against official Microchip documentation to confirm pinout and packaging details. Ensure compatibility with D3PAK footprints in PCB design. Confirm RoHS compliance status through the latest datasheet revision. Validate thermal resistance values for your specific heatsinking configuration before finalizing procurement.
Selection Notes
Select this component when a 400 V rating and 30 A continuous current are required in a surface-mount form factor. The 22 ns recovery time makes it suitable for higher frequency operations compared to standard recovery diodes. Consider the D3PAK package constraints regarding board space and thermal dissipation requirements relative to through-hole alternatives like the TO-247 variants.
Part Context
This part belongs to Microchip's FRED diode portfolio, designed for efficient power conversion. It complements other devices in the series such as the APT30D40BCTG, offering similar electrical performance but in a different package style. The product line targets industrial and consumer electronics needing reliable high-speed rectification.
Replacement Considerations
The APT30D40BCTG serves as a functional alternative with identical electrical ratings but utilizes a TO-247-3 through-hole package. Verify footprint differences and mounting requirements when substituting. No direct surface-mount equivalents with identical specs were identified in the provided data.
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