APT30D60BHBG

Overview

The APT30D60BHBG is a standard diode array manufactured by Microchip Technology, designed for through-hole mounting in the TO-247-3 package. It features a maximum DC reverse voltage of 600 V and an average rectified forward current of 27 A. The device exhibits a forward voltage of 2.4 V at 30 A and a reverse leakage current of 25 µA at 600 V. Its junction temperature range spans from -55°C to 175°C, supporting high-temperature operation.

Feature Summary

• Configured as a dual diode array with one pair connected in series within a single three-terminal package.
• Utilizes Through-Hole technology for robust mechanical attachment on printed circuit boards.

Applications

• High-frequency power conversion circuits
• Industrial motor drive systems
• Uninterruptible power supply (UPS) units

Procurement Notes

Verify the specific suffix against official Microchip documentation to confirm pinout compatibility and thermal characteristics. Ensure the procurement source provides valid RoHS compliance data. Cross-reference the part number with the manufacturer's latest datasheet to confirm availability status and production lifecycle stage before finalizing orders.

Selection Notes

Select this component when a compact, high-current dual diode solution is required for 600 V applications. The TO-247-3 package offers superior thermal dissipation compared to smaller footprints. Consider the 27 A continuous current rating and 175°C junction limit for demanding industrial environments where space constraints preclude discrete diode arrangements.

Part Context

This component belongs to the APT30D series of fast recovery diodes produced by Microchip Technology. It serves as a specialized alternative to discrete diode pairs, integrating two devices into a single TO-247-3 housing. This configuration simplifies board layout while maintaining high performance standards for power electronics applications.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing designs using electrical parameter matching rather than direct cross-referencing without official substitution lists.