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Product Detailed Parameters
- Description:DIODE STANDARD 600V 30A D3PAK
- Series:-
- Mfr:Microchip Technology
- Package:Tape & Reel (TR),Cut Tape (CT)
- Technology:Standard
- Voltage - DC Reverse (Vr) (Max):600 V
- Current - Average Rectified (Io):30A
- Voltage - Forward (Vf) (Max) @ If:-
- Speed:-
- Reverse Recovery Time (trr):-
- Current - Reverse Leakage @ Vr:-
- Capacitance @ Vr, F:-
- Mounting Type:Surface Mount
- Package / Case:TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
- Supplier Device Package:D3PAK
- Operating Temperature - Junction:-
- Grade:-
- Qualification:-
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Overview
The Microchip Technology APT30D60SG/TR is a surface-mount ultrafast soft recovery rectifier diode housed in a D3PAK-3 package. It features a maximum DC reverse voltage of 600 V and an average forward current rating of 30 A at a case temperature of 140°C with a 0.5 duty cycle. The device exhibits a typical forward voltage of 1.8 V at 30 A and a maximum reverse leakage current of 250 µA. Dynamic characteristics include a reverse recovery time of 23 ns and a reverse recovery charge of 0.289 nC under standard test conditions.
Feature Summary
- Ultrafast recovery times combined with soft recovery characteristics to minimize switching noise.
- Low forward voltage drop and low leakage current for improved efficiency.
- Designed for cooler operation and higher reliability in dense power systems.
Applications
- Anti-parallel diode in switchmode power supplies and inverters
- Free-wheeling diode in motor controllers, converters, and inverters
- Snubber diode applications
- Power factor correction (PFC) circuits
Procurement Notes
Verify the specific ordering suffix to confirm the tape and reel packaging format required for automated assembly processes. Ensure that the RoHS compliant designation matches environmental compliance requirements for the target manufacturing region. Cross-reference the manufacturer part number against official datasheets to validate the D3PAK-3 surface mount configuration before finalizing procurement orders.
Selection Notes
Select this component when a surface mount solution is required for high-frequency switching applications. The D3PAK-3 package facilitates automated placement while maintaining thermal performance comparable to through-hole alternatives. Evaluate the junction-to-case thermal resistance and maximum surge current capabilities against the specific circuit load profiles to ensure adequate safety margins during transient events.
Part Context
This device belongs to the APT30D series of ultrafast soft recovery rectifiers manufactured by Microchip Technology. The 'S' variant specifically denotes the surface mount D3PAK package option, distinct from the TO-247 through-hole version. The trailing '/TR' indicates the unit is supplied in a tape and reel format suitable for high-volume surface mount technology production lines.
Replacement Considerations
APT30D60B/S variants offer identical electrical specifications but utilize different physical packages or non-tape packaging formats.
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