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Product Detailed Parameters
- Description：IGBT 600V 86A 284W SOT227
- Series：POWER MOS 7®
- Mfr：Microchip Technology
- Package：Tube
- IGBT Type：PT
- Configuration：Single
- Vce(on) (Max) @ Vge, Ic：2.7V @ 15V, 40A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-
- Mounting Type：Chassis Mount
- Package / Case：ISOTOP
- Supplier Device Package：ISOTOP®
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：86 A
- Power - Max：284 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：4.61 nF @ 25 V
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Overview
The APT40GP60J is a single-channel silicon IGBT module manufactured by Microchip Technology. It utilizes PT MOS 7 technology and features an ISOTOP-4 (SOT-227) surface-mount package. The device supports a maximum collector-emitter voltage of 600 V with a continuous collector current of 86 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 2.2 V, a gate-emitter leakage current of 100 nA, and a power dissipation rating of 284 W. The component operates within a temperature range of -55°C to +150°C and accepts a maximum gate-emitter voltage of 20 V.
Feature Summary
- ISOTOP-4 surface-mount packaging for compact board integration
- PT MOS 7 technology for optimized switching performance
- High thermal stability across extended industrial temperature ranges
Applications
- Industrial motor drives
- Switched-mode power supplies
- Inverter circuits
Procurement Notes
Verify the specific datasheet revision and Product Change Notification history before procurement. Confirm that the ISOTOP-4 footprint matches the target PCB layout. Ensure the gate drive circuitry accommodates the 20 V maximum gate-emitter voltage limit to prevent device damage during operation.
Selection Notes
Select this component when a single high-current IGBT in a surface-mount form factor is required. The 86 A continuous current rating suits moderate-power applications. Verify that the 2.2 V saturation voltage meets efficiency targets. Compare against through-hole alternatives if higher peak current handling or different thermal resistance characteristics are necessary for the specific design constraints.
Part Context
This part belongs to the Microchip APT series of discrete and power modules. It represents the transition from traditional through-hole IGBTs to surface-mount solutions using the ISOTOP family. The device integrates the semiconductor die with a standardized mechanical outline to facilitate automated assembly and improved thermal management in modern power electronics designs.
Replacement Considerations
Direct pin-compatible replacements may include other ISOTOP-4 packaged IGBTs from the same manufacturer series. Verify voltage and current ratings match exactly. Cross-reference with similar packages from other vendors only if thermal and electrical specifications align precisely.
