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Product Detailed Parameters
- Description：IGBT MODULE 600V 86A 284W ISOTOP
- Series：POWER MOS 7®
- Mfr：Microchip Technology
- Package：Tube
- IGBT Type：PT
- Configuration：Single
- Vce(on) (Max) @ Vge, Ic：2.7V @ 15V, 40A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-55°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SOT-227-4, miniBLOC
- Supplier Device Package：ISOTOP®
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：86 A
- Power - Max：284 W
- Current - Collector Cutoff (Max)：500 µA
- Input Capacitance (Cies) @ Vce：4.61 nF @ 25 V
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Overview
The APT40GP60JDQ2 is a single IGBT module manufactured by Microchip Technology, utilizing Silicon PT MOS 7 Combi technology. It features a maximum collector-emitter voltage (VCEO) of 600 V and a continuous collector current of 86 A at 25°C. The device exhibits a collector-emitter saturation voltage of 2.2 V and a gate-emitter leakage current of 100 nA. Maximum power dissipation is rated at 284 W, with an operating temperature range from -55°C to +150°C. The component is housed in an ISOTOP-4 package for surface mount installation and supports a maximum gate-emitter voltage of 30 V.
Feature Summary
- Integrates PT MOS 7 Combi technology for optimized switching performance
- Features ISOTOP-4 packaging designed for efficient thermal management
- Supports surface mount installation for automated assembly processes
Applications
- Industrial motor drives
- Uninterruptible power supplies
- High-frequency inverters
Procurement Notes
Verify the specific ordering suffix against official Microchip documentation to ensure correct configuration. Confirm RoHS compliance status through the manufacturer's datasheet or environmental declaration. Check for recent Product Change Notifications regarding material or process updates before finalizing procurement specifications.
Selection Notes
Select this component based on its 600 V rating and 86 A current capacity requirements. Ensure the application design accommodates the 284 W power dissipation limit within the specified temperature range. Verify that the PCB layout supports the ISOTOP-4 surface mount footprint and thermal pad requirements for adequate heat sinking.
Part Context
This part belongs to the APT series of discrete IGBT modules produced by Microchip Technology. It utilizes the company's proprietary PT MOS 7 technology, which combines trench gate and field-stop structures. The ISOTOP-4 package provides electrical isolation and mechanical robustness suitable for demanding power electronics applications requiring high reliability.
Replacement Considerations
Direct substitutes include the APT50GP60JDQ2, which offers higher current capability within the same voltage and package constraints. Other compatible options may include variants from the same APT family with adjusted current ratings, provided pin compatibility and thermal characteristics align with the existing design.
