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Product Detailed Parameters
- Description：IGBT MOD 600V 130A 430W
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：Full Bridge
- Vce(on) (Max) @ Vge, Ic：2.45V @ 15V, 100A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 125°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：130 A
- Power - Max：430 W
- Current - Collector Cutoff (Max)：500 µA
- Input Capacitance (Cies) @ Vce：4.3 nF @ 25 V
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Overview
The BSM100GD60DLCBDLA1 is a full-bridge IGBT module manufactured by Infineon Technologies. It features a maximum collector-emitter breakdown voltage of 600 V and a continuous collector current rating of 130 A. The module has a maximum power dissipation capacity of 430 W and operates with a maximum junction temperature of 150°C. Key electrical characteristics include a typical on-state collector-emitter voltage (Vce(on)) of 3 V at 15 V gate drive and 100 A collector current. The input capacitance (Cies) is specified as 6.5 nF at 25 V. This component utilizes chassis mounting for thermal management and is designed for high-power industrial applications.
Feature Summary
- Full-bridge configuration integrating four IGBTs and diodes in a single module
- High current handling capability with 130 A continuous collector current rating
- Robust thermal design supporting operation up to 150°C junction temperature
- Chassis mount package optimized for efficient heat dissipation in power systems
Applications
- Industrial motor drives and inverters
- Uninterruptible power supplies (UPS)
- Induction heating systems
- Welding equipment power stages
Procurement Notes
Verify the specific suffix 'BDLA1' against official Infineon documentation to confirm exact pinout, terminal plating, and internal die configuration. Ensure compatibility with existing cooling solutions due to chassis-mount requirements. Confirm availability status as product lifecycle changes may affect long-term supply. Cross-reference datasheet parameters with system design limits to ensure safe operating area compliance.
Selection Notes
Select this module for applications requiring a compact full-bridge topology with high current density. Consider the 600 V rating for medium-voltage AC systems. Evaluate thermal resistance requirements against the 430 W dissipation limit. Compare against alternative modules like BSM100GD60DLC if different packaging or specific electrical tolerances are needed. Ensure gate drive voltage matches the 15 V specification for optimal Vce(on) performance.
Part Context
This part belongs to the BSM100 series of IGBT modules from Infineon Technologies. The series is characterized by high reliability and efficiency in power conversion applications. The 'GD' designation typically indicates specific technology generation, while '60' refers to the 600 V voltage class. The module integrates fast recovery diodes with the IGBTs for complete bridge functionality.
Replacement Considerations
The BSM100GD60DLCBDLA1 is functionally similar to the BSM100GD60DLC. Verify mechanical dimensions and terminal configurations before substitution. Check if the 'BDLA1' suffix implies specific material or processing differences compared to standard variants. Consult Infineon's replacement guide for officially confirmed substitutes.
