APT75DQ60BG

APT75DQ60BG

$2.21
  • Description:DIODE STD 600V 75A TO247 [B]
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tube

SKU:3e1e4c2c8014 Category: Brand:

  
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Product Detailed Parameters

  • Description:DIODE STD 600V 75A TO247 [B]
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tube
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):600 V
  • Current - Average Rectified (Io):75A
  • Voltage - Forward (Vf) (Max) @ If:2.5 V @ 75 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):31 ns
  • Current - Reverse Leakage @ Vr:25 µA @ 600 V
  • Capacitance @ Vr, F:-
  • Mounting Type:Through Hole
  • Package / Case:TO-247-2
  • Supplier Device Package:TO-247 [B]
  • Operating Temperature - Junction:-55°C ~ 175°C
  • Grade:-
  • Qualification:-

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APT75DQ60BG

Overview

The APT75DQ60BG is a Fast Recovery Epitaxial Diode (FRED) manufactured by Microchip Technology. It features a dual configuration housed in a TO-247-2 package designed for through-hole mounting. The device supports a maximum repetitive reverse voltage of 600 V and a continuous forward current of 75 A. It operates within a junction temperature range from -55 °C to +175 °C.

Feature Summary

  • Dual common cathode configuration for efficient rectification
  • Fast recovery epitaxial diode technology for high-speed switching
  • High thermal stability with extended operating temperature range

Applications

  • High-frequency power supply circuits
  • Motor drive freewheeling applications
  • Uninterruptible power supply (UPS) systems

Procurement Notes

Verify the specific ordering suffix against official Microchip documentation to ensure correct pinout and electrical characteristics. Confirm RoHS compliance status directly with the manufacturer or authorized distributors prior to procurement. Ensure the selected component matches the required thermal management specifications for the intended application environment.

Selection Notes

Select this component for applications requiring high current handling and fast recovery times in a standard through-hole package. Evaluate thermal dissipation requirements carefully as the TO-247-2 package relies on external heatsinking for optimal performance at full load conditions. Compare total cost of ownership including thermal management solutions when considering alternative packages.

Part Context

This part belongs to the APT series of power discrete semiconductors produced by Microchip Technology. The series encompasses various IGBTs, diodes, and modules designed for industrial and automotive power electronics. The APT75DQ60BG specifically addresses needs for robust rectification in medium-to-high power conversion systems.

Replacement Considerations

Consult official Microchip cross-reference guides for verified substitutes. Ensure any replacement maintains identical voltage ratings, current capacity, and package dimensions to fit existing board layouts without modification.

APT75DQ60BGAPT75DQ60BG
$2.21
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