APT75DQ60D

APT75DQ60D

  • Description:FRED DQ 600 V 75 A DIE
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk

SKU:26a7333cffbb Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:FRED DQ 600 V 75 A DIE
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • Technology:-
  • Voltage - DC Reverse (Vr) (Max):-
  • Current - Average Rectified (Io):-
  • Voltage - Forward (Vf) (Max) @ If:-
  • Speed:-
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:-
  • Capacitance @ Vr, F:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Operating Temperature - Junction:-
  • Grade:-
  • Qualification:-

Download product information

APT75DQ60D

Overview

The APT75DQ60D is a silicon Fast Recovery Epitaxial Diode (FRED) manufactured by Microchip Technology. It is supplied as a bare die intended for integration into custom power modules or discrete assemblies. The component features a dual configuration with a reverse voltage rating of 600 V and a forward current capacity of 75 A. Originating from the Philippines, this device is designed for high-efficiency switching applications requiring fast recovery characteristics.

Feature Summary

  • Dual anti-parallel diode configuration
  • Fast recovery epitaxial diode technology
  • High thermal conductivity silicon construction

Applications

  • Custom power module assembly
  • Discrete semiconductor packaging
  • High-frequency switching circuits

Procurement Notes

Verify the specific lot marking and wafer map details directly with Microchip Technology before procurement. As a bare die product, ensure that handling equipment and assembly processes are compatible with fragile semiconductor substrates. Confirm compliance with RoHS directives and check for any recent Product Change Notifications (PCNs) that may affect material composition or manufacturing location.

Selection Notes

Select this component when designing custom power modules requiring integrated FRED functionality in a compact form factor. Ensure the host package provides adequate thermal management for the specified current ratings. Verify that the gate drive or circuit topology matches the 600 V blocking capability and 75 A conduction requirements of the die.

Part Context

This part belongs to Microchip's discrete semiconductor module portfolio, specifically within the FRED category. It complements other packaged variants like the APT2X60DQ100J but offers a bare die solution for manufacturers integrating diodes directly into their own substrate designs rather than purchasing pre-packaged units.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Engineers should consult Microchip Technology directly for qualified alternatives or cross-reference options based on specific electrical and mechanical constraints.

APT75DQ60DAPT75DQ60D

Click on the inquiry