APTC60AM42F2G

Overview

The APTC60AM42F2G is a CoolMOS SP1 phase leg power module featuring Super Junction MOSFET technology. It provides a 600V drain-source breakdown voltage and a maximum on-resistance of 42mΩ at 25°C. The device supports a continuous drain current of 66A at 25°C case temperature, with a pulsed current rating of 200A. Total gate charge is typically 510nC at 10V. The package includes an isolated design allowing direct heatsink mounting, with a junction-to-case thermal resistance of 0.3°C/W and an isolation voltage of 4000Vrms.

Feature Summary

• CoolMOS SP1 technology delivering ultra-low on-resistance and low Miller capacitance for high-frequency efficiency
• Integrated Kelvin source pin configuration to facilitate easy gate drive implementation
• Rugged avalanche energy rated construction with fast intrinsic body diode characteristics
• Isolated package architecture enabling direct mounting to heatsinks with high isolation voltage

Applications

• Welding converters
• Switched Mode Power Supplies
• Uninterruptible Power Supplies
• Motor control systems

Procurement Notes

Verify the specific ordering suffix F2G against official Microsemi documentation to confirm exact package variant and compliance status. Ensure electrostatic discharge handling procedures are followed during assembly as specified in application note APT0502. Confirm that the SP2 package outline dimensions match the mechanical constraints of the target design before finalizing procurement.

Selection Notes

Select this component for applications requiring high switching frequencies and robust thermal performance within a compact form factor. The low gate charge and Miller capacitance support efficient driver design. Evaluate the 42mΩ on-resistance against conduction loss requirements at the intended operating current. Consider the 600V rating for compatibility with standard bus voltages in power conversion topologies.

Part Context

This part belongs to the Microsemi CoolMOS SP1 series of discrete and power modules. It utilizes Silicon technology in an SP2 package format. The module integrates a phase leg configuration, combining complementary switching elements into a single unit to reduce parasitic inductance and simplify system integration compared to discrete solutions.

Replacement Considerations

Consult official Microsemi substitution guides for verified equivalents. Cross-reference electrical parameters such as RDS(on), VDS, and package dimensions when evaluating alternative components from other manufacturers to ensure functional compatibility.