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Product Detailed Parameters
- Description：MOSFET 4N-CH 600V 39A SP3
- Series：CoolMOS™
- Mfr：Microchip Technology
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：4 N-Channel (Full Bridge) + Bridge Rectifier
- FET Feature：-
- Drain to Source Voltage (Vdss)：600V
- Current - Continuous Drain (Id) @ 25°C：39A
- Rds On (Max) @ Id, Vgs：70mOhm @ 39A, 10V
- Vgs(th) (Max) @ Id：3.9V @ 2.7mA
- Gate Charge (Qg) (Max) @ Vgs：259nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：7000pF @ 25V
- Power - Max：250W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：-
- Package / Case：SP3
- Supplier Device Package：SP3
- Grade：-
- Qualification：-
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Overview
The APTC60HM70RT3G is a PM-MOSFET CoolMOS SP3F module manufactured by Microchip Technology. It utilizes Silicon technology and features an SP3F package designed for screw mount installation. The device operates within a temperature range of -40°C to +150°C junction temperature. Key electrical specifications include a drain-source breakdown voltage of 600V, a continuous drain current of 60A, and a maximum power dissipation of 176W. The module integrates an NTC thermistor for thermal monitoring.
Feature Summary
- Integrates CoolMOS SP3F technology for optimized switching performance and low conduction losses.
- Includes an integrated NTC thermistor for precise thermal management and protection.
- Designed with a robust baseplate for efficient heat transfer and direct heatsink mounting.
Applications
- High-efficiency switched-mode power supplies
- Industrial motor drive inverters
- Uninterruptible power supply (UPS) systems
Procurement Notes
Verify the specific suffix RT3G against the official Microchip datasheet to confirm packaging type and tape/reel specifications. Ensure the SP3F footprint matches your mechanical design constraints. Confirm RoHS compliance status through the manufacturer's latest product change notifications or compliance documentation before finalizing procurement orders.
Selection Notes
Select this component when a 600V rating and 60A continuous current capacity are required in a compact SP3F form factor. The integrated NTC sensor simplifies thermal protection circuitry design. Consider the thermal resistance characteristics relative to your heatsink solution to ensure junction temperatures remain within the specified operational limits during peak load conditions.
Part Context
This module belongs to the APTC series of discrete semiconductor modules from Microchip Technology. It represents the integration of Power MOSFETs with CoolMOS technology in a standardized SP3F housing. This series targets applications demanding high reliability and efficient thermal management in power conversion environments.
Replacement Considerations
Consult Microchip's official cross-reference guides for verified substitutes. Ensure any replacement maintains the SP3F footprint, 600V/60A ratings, and integrated NTC functionality to preserve system compatibility without redesigning the PCB or thermal interface.
