APTC60TDUM35PG

$230.17

Description：MOSFET 6N-CH 600V 72A SP6-P
Series：-

SKU:cd7835a3d581 Category: FET, MOSFET Arrays Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：MOSFET 6N-CH 600V 72A SP6-P
Series：-
Mfr：Microchip Technology
Package：Bulk
Technology：MOSFET (Metal Oxide)
Configuration：6 N-Channel (3-Phase Bridge)
FET Feature：-
Drain to Source Voltage (Vdss)：600V
Current - Continuous Drain (Id) @ 25°C：72A
Rds On (Max) @ Id, Vgs：35mOhm @ 72A, 10V
Vgs(th) (Max) @ Id：3.9V @ 5.4mA
Gate Charge (Qg) (Max) @ Vgs：518nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds：14000pF @ 25V
Power - Max：416W
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP6
Supplier Device Package：SP6-P
Grade：-
Qualification：-

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APTC60TDUM35PG

Overview

The APTC60TDUM35PG is a discrete semiconductor module manufactured by Microchip Technology. It utilizes Silicon (Si) technology and belongs to the CoolMOS SP1 family. The component is housed in an SP6-P package with screw mount installation style. It is classified as a MOSFET module, specifically designed for power switching applications requiring robust thermal management and high voltage handling capabilities within industrial environments.

Feature Summary

Integrates CoolMOS SP1 technology for optimized switching performance
Features a rugged SP6-P module package for secure mounting
Designed for high-voltage silicon-based power conversion

Applications

Industrial motor drives
Uninterruptible power supplies
High-frequency power converters

Procurement Notes

Verify the specific suffix against official Microchip documentation to confirm exact electrical characteristics and pinout compatibility. Ensure the SP6-P package dimensions match the target heatsink interface. Confirm RoHS compliance status through the latest datasheet revision before finalizing procurement specifications.

Selection Notes

Select this module when a three-phase bridge configuration or similar high-current topology is required. Evaluate thermal resistance values relative to the application's cooling strategy. Compare gate charge parameters against available driver capabilities to ensure efficient switching transitions and minimize losses.

Part Context

This part falls under Microchip's CoolMOS portfolio, which combines superjunction MOSFET technology with integrated diodes. The SP6-P package is commonly used in medium-power industrial applications. It serves as a key component in systems demanding high efficiency and reliability in harsh operating conditions.

Replacement Considerations

Consult official substitution guides for compatible modules within the same CoolMOS SP series. Verify that alternative parts share identical pin configurations and thermal footprints to avoid redesigning the PCB or mechanical assembly.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.