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Product Detailed Parameters
- Description：IGBT MODULE 600V 50A 250W SP3
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Boost Chopper, Full Bridge
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 50A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP3
- Supplier Device Package：SP3
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：50 A
- Power - Max：250 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：3.15 nF @ 25 V
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Overview
The APTCV60HM45BC20T3G is a silicon-based power module from Microchip Technology, classified under discrete semiconductor modules. It features a Superjunction MOSFET technology with a typical on-resistance of 45 mΩ and a rated current of 38 A. The device utilizes the SP3F package configuration and integrates a Si MOSFET driver type. This component is designed for high-efficiency power conversion applications requiring low Miller capacitance and ultra-low gate charge characteristics.
Feature Summary
- Integrates PFC, bypass, and full bridge configurations within a single module
- Utilizes Superjunction MOSFET technology for reduced on-resistance
- Features Kelvin source connection to facilitate easy drive circuitry
- Rated for avalanche energy handling to enhance system robustness
Applications
- Power Factor Correction circuits
- Bypass switching stages
- Full bridge inverter topologies
Procurement Notes
Verify the specific suffix T3G against the manufacturer's latest documentation to confirm pinout compatibility and thermal interface specifications. Ensure that the SP3F package dimensions align with the target PCB footprint and heatsinking requirements before finalizing procurement orders.
Selection Notes
Select this module when designing systems requiring integrated PFC and bridge functions to minimize component count. The 45 mΩ RDSon and 38 A rating suit medium-power industrial applications. Consider the SP3F package constraints and thermal management needs relative to the expected operating junction temperature range.
Part Context
This part belongs to the APTC series of power modules by Microchip Technology. It represents a consolidation of multiple power switches into a single package to improve reliability and reduce assembly complexity compared to discrete solutions.
Replacement Considerations
Direct substitutes include APTCV60HM45BC20T1G or other variants within the same SP3F family offering identical electrical ratings. Verify datasheet errata regarding package revisions before swapping.
