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APTDF100H120G is listed in the Bridge Rectifier range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is BRIDGE RECT 1P 1.2KV 120A SP4. Review the specifications below when checking this part for your BOM.
The APTDF100H120G is a single-phase full bridge diode module manufactured by Microsemi Corporation. It features a 1200 V reverse voltage rating and supports an average forward current of 100 A. The device utilizes silicon technology with ultra-fast recovery characteristics and soft recovery behavior to minimize switching losses. Designed for screw mount installation, it operates within a junction temperature range of -40°C to +175°C. The module is housed in an SP6C package, providing robust performance for high-power rectification applications.
Verify the specific suffix and revision level against the official Microsemi datasheet to ensure compatibility with existing thermal management and mounting hardware. Confirm that the requested quantity aligns with standard factory packaging configurations. Check for any recent product change notices or end-of-life announcements prior to finalizing procurement orders.
Select this component when designing circuits requiring a pre-configured single-phase bridge with high voltage tolerance. Ensure the system's thermal dissipation strategy can handle the specified power losses at the intended operating current. Verify that the gate drive or control logic does not apply unnecessary stress to the diode recovery characteristics during commutation events.
This part belongs to Microsemi's high-voltage power discrete and module portfolio, specifically designed for industrial power conversion. It complements other modules like the APTGT series IGBTs and APTDF200 series diodes, offering a standardized footprint for scalable power electronics designs across various voltage and current ratings.
Direct substitutes may include the APTDF100H170G for higher voltage requirements or the APTDF200H100G for increased current capacity. Verify pinout compatibility and thermal resistance values before swapping components to maintain system integrity.
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