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APTDF400AK120G
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Product Detailed Parameters
- Description：DIODE MODULE GP 1200V 470A SP6
- Series：-
- Mfr：Microchip Technology
- Package：Tube
- Diode Configuration：1 Pair Series Connection
- Technology：Standard
- Voltage - DC Reverse (Vr) (Max)：1200 V
- Current - Average Rectified (Io) (per Diode)：470A
- Voltage - Forward (Vf) (Max) @ If：3 V @ 400 A
- Speed：Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：385 ns
- Current - Reverse Leakage @ Vr：250 µA @ 1200 V
- Operating Temperature - Junction：-
- Mounting Type：Chassis Mount
- Package / Case：LP4
- Supplier Device Package：SP6
- Grade：-
- Qualification：-
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Overview
The APTDF400AK120G is a silicon Fast Recovery Epitaxial Diode (FRED) module manufactured by Microchip Technology. It features a double series configuration with a maximum repetitive reverse voltage of 1.2 kV and a load current rating of 400 A at Tc=80°C. The module utilizes the SP6C package style, designed for screw mounting applications. Key electrical characteristics include a forward voltage of 2.4 V and a silicon semiconductor structure optimized for high-power switching operations.
Feature Summary
- Double series diode configuration for phase leg applications
- Fast recovery epitaxial diode technology
- SP6C package design for robust thermal management
Applications
- Industrial motor drives
- Uninterruptible power supplies
- High-frequency inverter circuits
Procurement Notes
Verify the specific datasheet version to confirm exact thermal resistance values and pinout configurations before integration. Ensure that the cooling interface matches the SP6C mechanical specifications. Cross-reference the manufacturer's latest reliability data sheets for long-term operational limits. Confirm compliance with RoHS directives if required for the target market. Validate gate drive isolation requirements against the module's voltage ratings.
Selection Notes
Select this component for applications requiring high-voltage blocking capabilities and fast switching speeds. The 1.2 kV rating suits medium-voltage industrial systems. Consider the 400 A current capacity relative to the thermal management solution. The double series structure aids in balancing voltage stress across multiple devices. Evaluate the SP6C footprint against available board space constraints.
Part Context
This part belongs to Microchip's APTDF series of high-power diode modules. It complements other IGBT and diode offerings in the company's portfolio for complete power conversion solutions. The SP6C packaging standardizes mechanical integration across various power levels within the family.
Replacement Considerations
Direct substitutes may include other 1.2 kV FRED modules in similar packages from Microchip or compatible manufacturers. Verify current ratings and forward voltage drops to ensure equivalent performance. Check mechanical dimensions for compatibility with existing heatsink interfaces.
