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APTDF400KK20G
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Product Detailed Parameters
- Description：DIODE MODULE GP 200V 500A SP6
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Diode Configuration：1 Pair Common Cathode
- Technology：Standard
- Voltage - DC Reverse (Vr) (Max)：200 V
- Current - Average Rectified (Io) (per Diode)：500A
- Voltage - Forward (Vf) (Max) @ If：1.1 V @ 400 A
- Speed：Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：60 ns
- Current - Reverse Leakage @ Vr：750 µA @ 200 V
- Operating Temperature - Junction：-
- Mounting Type：Chassis Mount
- Package / Case：LP4
- Supplier Device Package：SP6
- Grade：-
- Qualification：-
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Overview
The APTDF400KK20G is a silicon Fast Recovery Epitaxial Diode (FRED) module manufactured by Microchip Technology. It features a dual common cathode configuration housed in an SP-6C chassis mount package. The device supports a reverse voltage of 200 V and a forward current of 400 A at 80°C case temperature. Key electrical parameters include a forward voltage of 1.1 V, a reverse recovery time of 60 ns, and a minimum operating temperature of -40°C.
Feature Summary
- Ultra-fast recovery times for high-speed switching applications
- Soft recovery characteristics to minimize electromagnetic interference
- High current handling capability with low leakage current
Applications
- High-frequency power conversion systems
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- DC-DC converter circuits
Procurement Notes
Verify the specific datasheet revision and ordering suffixes to ensure compatibility with system requirements. Confirm thermal management specifications and mounting torque values for the SP-6C package during integration. Cross-reference official Microchip documentation for detailed electrical characteristics and absolute maximum ratings before deployment.
Selection Notes
Select this component for applications requiring high current capacity and fast switching speeds at low voltage levels. The dual common cathode design simplifies circuit topology for bridge configurations. Ensure adequate heatsinking to maintain junction temperatures within safe limits during continuous operation.
Part Context
This part belongs to Microchip's FRED diode module family, designed for robust performance in demanding power electronics environments. The SP-6C package provides efficient thermal dissipation and mechanical stability for chassis mounting. It complements other high-power discrete and module solutions offered by the manufacturer.
Replacement Considerations
Direct substitutes may include other 200V, 400A dual common cathode FRED modules from compatible manufacturers. Verify pinout compatibility, thermal resistance values, and reverse recovery time specifications when evaluating alternative components.
