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The APTGF25H120T1G is a full-bridge NPT IGBT power module with a 1200 V collector-emitter breakdown voltage. It supports a continuous collector current of 40 A at 25°C and 25 A at 80°C, with a maximum power dissipation of 208 W. The device features a collector-emitter saturation voltage of 3.7 V max at 25°C and 4.0 V max at 125°C. It operates within a junction temperature range of -40°C to 150°C and utilizes an SP1 package.
Verify component authenticity through authorized Microchip Technology distributors or official channels. Confirm that the specific unit matches the SP1 package outline and includes the internal NTC thermistor as documented. Ensure handling procedures account for electrostatic discharge sensitivity during installation.
Select this module for applications requiring a full-bridge configuration with isolated mounting capabilities. Evaluate thermal management requirements based on the 0.6 °C/W junction-to-case thermal resistance. Verify that the gate drive circuitry can support the specified 15 V operating voltage and manage the total gate charge of 160 nC effectively.
This component belongs to the Microsemi NPT IGBT power module family designed for robust high-power switching. It integrates both IGBTs and anti-parallel diodes into a single isolated package, facilitating compact phase leg designs in medium-power electronic systems.
Direct substitutes are not explicitly listed in the provided documentation. When evaluating alternatives, ensure the replacement maintains the 1200 V rating, SP1 footprint, and compatible electrical characteristics such as saturation voltage and switching energy losses.
The module supports switching frequencies up to 50 kHz due to its NPT Fast IGBT technology and low tail current characteristics.
It includes an integrated NTC thermistor for temperature monitoring, allowing for direct tracking of the internal thermal state.
The RMS isolation voltage from any terminal to the case is rated at 4000 V for one minute at 50/60 Hz.