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Product Detailed Parameters
- Description：IGBT MODULE 1200V 65A 220W SP3
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：2.25V @ 15V, 35A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP3
- Supplier Device Package：SP3
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：65 A
- Power - Max：220 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：1.95 nF @ 25 V
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Overview
The APTGL40X120T3G is a trench field-stop IGBT module manufactured by Microchip Technology. It features a dual configuration housed in an SP3-32 package with screw mount installation. The device supports a maximum collector-emitter voltage of 1200 V and a continuous collector current of 75 A at 25°C. Key electrical parameters include a saturation voltage of 2.05 V, power dissipation of 250 W, and a gate-emitter leakage current of 120 nA. Operating temperatures range from -40°C to +100°C.
Feature Summary
- Utilizes trench field-stop technology for optimized switching performance
- Designed as a dual configuration module for compact power applications
- Includes integrated NTC thermistor for thermal monitoring
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- High-frequency welding equipment
Procurement Notes
Verify the specific suffix against official datasheets to confirm pinout and thermal interface compatibility. Confirm RoHS compliance status through manufacturer documentation before integration. Ensure ordering quantities align with factory packaging standards to avoid partial reel issues.
Selection Notes
Select this component for applications requiring 1200 V blocking capability with moderate current handling. Evaluate thermal management requirements based on the 250 W dissipation rating. Compare saturation voltage characteristics against alternative modules to ensure efficiency targets are met within the specified temperature range.
Part Context
This module belongs to the APTGL series of high-voltage IGBTs. It represents a transition from legacy discrete designs to integrated power modules. The SP3-32 package provides a standardized footprint for mounting on heatsinks. It serves as a core switching element in medium-power conversion circuits.
Replacement Considerations
Direct substitutes may include other Microchip SP3-32 dual IGBT modules with matching 1200 V ratings. Verify pin compatibility and thermal resistance values when considering cross-brand alternatives.
