APTGL60TL120T3G

Overview

The APTGL60TL120T3G is a silicon IGBT module manufactured by Microchip Technology, designed for high-power switching applications. It features a single configuration housed in an SP1-12 screw-mount package. The device supports a maximum collector-emitter voltage of 1200 V and delivers a continuous collector current of 90 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 1.85 V and a gate-emitter leakage current of 600 nA. The module operates within a temperature range of -40°C to +100°C, with a power dissipation rating of 385 W and a maximum gate-emitter voltage of 20 V.

Feature Summary

• Single IGBT configuration optimized for robust power switching
• Screw-mount installation style for secure mechanical attachment
• Silicon technology ensuring reliable operation under thermal stress

Applications

• Industrial motor drives
• Uninterruptible power supplies (UPS)
• Inverter systems

Procurement Notes

Verify the specific datasheet revision and RoHS compliance status directly with Microchip Technology or authorized distributors before procurement. Confirm that the SP1-12 package dimensions match the target PCB or heatsink design requirements. Ensure that the supply chain source provides valid traceability documentation to guarantee component authenticity and quality standards.

Selection Notes

Select this component when a single-switch topology is required for 1200 V circuits. The 90 A continuous current rating suits moderate power levels where thermal management can maintain junction temperatures within the specified limits. Compare the 1.85 V saturation voltage against alternative devices to evaluate conduction losses relative to switching frequency requirements in the target application circuit.

Part Context

This part belongs to the APTGL series of discrete IGBT modules from Microchip Technology. It utilizes the SP1-12 package format, which is distinct from multi-chip configurations like dual or quad modules found in other series. The SP1-12 housing facilitates direct mounting to cold plates or heatsinks using standard screw fasteners, simplifying thermal interface design compared to soldered packages.

Replacement Considerations

Direct replacements must match the 1200 V rating, 90 A current capacity, and SP1-12 package outline. Verify pinout compatibility and thermal resistance characteristics. Cross-reference with other Microchip SP1 variants or competitor modules offering identical mechanical and electrical specifications to ensure seamless integration without redesigning the mounting hardware.