ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IGBT MODULE 650V 70A 175W SP1
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Full Bridge
- Vce(on) (Max) @ Vge, Ic：2.3V @ 15V, 50A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：SP1
- Voltage - Collector Emitter Breakdown (Max)：650 V
- Current - Collector (Ic) (Max)：70 A
- Power - Max：175 W
- Current - Collector Cutoff (Max)：50 µA
- Input Capacitance (Cies) @ Vce：3.1 nF @ 25 V
Download product information
Overview
The APTGLQ50H65T1G is a full bridge IGBT module utilizing Trench + Field Stop IGBT4 technology. It features a maximum collector-emitter voltage of 650 V and a continuous collector current of 70 A at 25°C. The saturation voltage is specified as 2.3 V at 15 V gate drive and 50 A collector current. Maximum power dissipation is 175 W, with an input capacitance of 3.1 nF at 25 V. The junction temperature range spans from -40°C to 175°C. It employs screw mount installation within the SP1 module package.
Feature Summary
- Integrates Trench + Field Stop IGBT4 technology for high-speed switching performance.
- Includes an integrated NTC thermistor for thermal monitoring.
- Configured as a full bridge topology for power conversion applications.
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- High-frequency inverters
Procurement Notes
Verify the specific ordering suffix against official Microchip Technology documentation to confirm exact electrical characteristics and packaging details. Cross-reference the manufacturer part number with authorized distributor catalogs to ensure component authenticity and traceability before procurement.
Selection Notes
Select this component based on its 650 V blocking capability and 70 A current rating. Ensure the application requires the SP1 package form factor and screw mounting style. Verify that the thermal management system supports the 175 W power dissipation limit and the 175°C maximum junction temperature specification.
Part Context
This device belongs to the APTGLQ series of high-speed IGBT modules manufactured by Microchip Technology. The series utilizes advanced trench field-stop technology to optimize switching losses and conduction voltage. The SP1 package provides a standardized footprint for industrial power electronics designs requiring robust isolation and thermal performance.
Replacement Considerations
Consult official Microchip cross-reference guides for verified substitutes. Potential alternatives include other APTGLQ series variants with adjusted current ratings or different package configurations, provided they match the 650 V voltage class and full bridge topology requirements.
FAQ
What is the maximum operating junction temperature?
The maximum operating junction temperature is 175°C.
Does the module include thermal sensing?
Yes, it includes an integrated NTC thermistor for thermal monitoring.
What is the gate-emitter voltage specification?
The datasheet specifies a saturation voltage test condition of 15 V gate drive; standard IGBT modules typically operate within a ±20 V gate-emitter voltage range.
