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Product Detailed Parameters
- Description：IGBT MODULE 600V 150A 340W SP4
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Dual, Common Source
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 100A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP4
- Supplier Device Package：SP4
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：150 A
- Power - Max：340 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：6.1 nF @ 25 V
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Overview
The APTGT100DU60TG is a silicon IGBT module manufactured by Microchip Technology, housed in an SP4 screw-mount package. It features a half-bridge configuration with a maximum collector-emitter voltage of 600 V and a continuous collector current of 150 A at 25°C. The saturation voltage is 1.5 V, while the power dissipation capacity reaches 340 W. Operating temperatures range from -40°C to +100°C, with a junction temperature limit of 175°C. The gate-emitter leakage current is specified at 400 nA, and the maximum gate-emitter voltage is 20 V.
Feature Summary
- Trench Field-Stop (TFS) technology for optimized switching performance
- Integrated NTC thermistor for precise thermal monitoring
- Screw-mount design for secure mechanical installation
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Inverter systems
Procurement Notes
Verify the specific suffix against official datasheets to confirm pinout and thermal interface compatibility. Confirm RoHS compliance status through manufacturer documentation before integration. Ensure ordering quantities align with factory packaging requirements. Validate that the SP4 package dimensions match the target heatsink interface specifications.
Selection Notes
Select this component for applications requiring a 600V half-bridge topology with high current handling capabilities. The SP4 package offers a balance between power density and thermal management ease. Consider the integrated NTC sensor if active thermal protection is required. Verify that the 150A continuous current rating meets the peak load demands of the specific circuit design.
Part Context
This part belongs to the Thunderbolt series of IGBT modules from Microchip Technology. It utilizes Trench Field-Stop technology to enhance efficiency compared to older planar designs. The SP4 package is commonly used in medium-power industrial applications where robust mounting and reliable thermal transfer are critical for long-term operation.
Replacement Considerations
Direct replacements include the APTGT100DH60TG and APTGT100H60T3G. Verify pin compatibility and thermal resistance values when substituting. Ensure the alternative part maintains the same voltage and current ratings for equivalent performance.
