APTGT150DH120G

$138.45

Description：IGBT MODULE 1200V 220A 690W SP6
Series：-

SKU:e623d4ac8b92 Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 1200V 220A 690W SP6
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Asymmetrical Bridge
Vce(on) (Max) @ Vge, Ic：2.1V @ 15V, 150A
Input：Standard
NTC Thermistor：No
Operating Temperature：-
Mounting Type：Chassis Mount
Package / Case：SP6
Supplier Device Package：SP6
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：220 A
Power - Max：690 W
Current - Collector Cutoff (Max)：350 µA
Input Capacitance (Cies) @ Vce：10.7 nF @ 25 V

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APTGT150DH120G

Overview

The Microchip Technology APTGT150DH120G is a Trench Field Stop IGBT module in the SP6 package. It features an asymmetrical bridge configuration with a maximum collector-emitter voltage of 1200 V and a continuous collector current of 220 A at 25°C. The device has a saturated collector-emitter voltage of 1.7 V, a power dissipation rating of 690 W, and operates within a temperature range of -40°C to +100°C.

Feature Summary

Utilizes Trench Field Stop technology for optimized switching performance
Asymmetrical bridge configuration designed for high-voltage applications
Screw mount installation style for secure chassis integration

Applications

Industrial motor drives
Uninterruptible power supplies
High-frequency induction heating

Procurement Notes

Verify the specific datasheet revision and technical parameters directly from the manufacturer's official documentation before integration. Confirm that the SP6 package dimensions and thermal characteristics align with the target heatsink design. Ensure gate drive requirements match the specified voltage limits to prevent device damage during operation.

Selection Notes

Select this component for applications requiring robust 1200 V blocking capability and high current handling up to 220 A. The asymmetrical design suits circuits where reverse voltage blocking is not required. Evaluate thermal management needs based on the 690 W dissipation rating and ensure adequate cooling for the SP6 package form factor.

Part Context

This part belongs to the Microchip PowerTrench series of IGBT modules. It is engineered for efficiency in power conversion systems. The SP6 packaging provides a standardized footprint for easy replacement and integration into existing industrial power electronics architectures.