APTGT20H60T1G

$38.43

Description：IGBT MODULE 600V 32A 62W SP1
Series：-

SKU:2a4c12cb7464 Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 600V 32A 62W SP1
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Full Bridge Inverter
Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 20A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP1
Supplier Device Package：SP1
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：32 A
Power - Max：62 W
Current - Collector Cutoff (Max)：250 µA
Input Capacitance (Cies) @ Vce：1.1 nF @ 25 V

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APTGT20H60T1G

Overview

The APTGT20H60T1G is a silicon-based IGBT module manufactured by Microchip Technology, housed in the SP1-12 package. It features a full bridge configuration with a maximum collector-emitter voltage of 600 V and a continuous collector current of 20 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.5 V and a power dissipation rating of 90 W. Operating within a temperature range of -40°C to +100°C, it utilizes screw mount installation and adheres to RoHS standards.

Feature Summary

Full bridge topology for efficient power conversion
Screw mount installation style for secure mechanical attachment
Silicon technology construction for reliable switching performance

Applications

Industrial motor drives
Uninterruptible power supplies
Inverter circuits

Procurement Notes

Verify the complete part number including suffixes against official Microchip Technology documentation to ensure correct configuration. Confirm package type and electrical ratings match design requirements before ordering. Check for any recent product change notifications or datasheet revisions that may affect compatibility or specifications.

Selection Notes

Select this component when a 600 V full bridge IGBT module with 20 A continuous current capability is required. Ensure thermal management solutions support the 90 W power dissipation rating. Verify that the SP1-12 package dimensions and screw mount terminals fit the intended PCB or chassis layout constraints.

Part Context

This module belongs to the Microchip Technology IGBT module family, specifically designed for medium-power applications. It shares the SP1-12 packaging format with other variants in the series, offering standardized mounting and electrical interfaces for system designers integrating multiple power stages.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.