APTGT25A120T1G

$24.90

Description：IGBT MODULE 1200V 40A 156W SP1
Series：-

SKU:9b43e58a7d3e Category: IGBT Modules Brand: Microsemi Corporation

Consult the customer manager about the wholesale price.

consultation hotline：86-132-6715-2157

email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.

Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Product introduction

Product Detailed Parameters

Description：IGBT MODULE 1200V 40A 156W SP1
Series：-
Mfr：Microsemi Corporation
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Half Bridge
Vce(on) (Max) @ Vge, Ic：2.1V @ 15V, 25A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP1
Supplier Device Package：SP1
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：40 A
Power - Max：156 W
Current - Collector Cutoff (Max)：250 µA
Input Capacitance (Cies) @ Vce：1.8 nF @ 25 V

Download product information

APTGT25A120T1G

Overview

The APTGT25A120T1G is a half-bridge IGBT power module utilizing Fast Trench + Field Stop technology. It features a 1200 V collector-emitter breakdown voltage and supports a continuous collector current of 40 A at 25°C, or 25 A at 80°C case temperature. The maximum power dissipation is 156 W at 25°C. The module includes an integrated NTC thermistor for thermal monitoring and operates within a junction temperature range of -40°C to 150°C. It provides an isolation voltage of 2500 V RMS between terminals and the case.

Feature Summary

Fast Trench + Field Stop IGBT technology with low voltage drop and soft recovery parallel diodes
Internal NTC thermistor for precise temperature monitoring
Symmetrical design ensuring very low stray inductance
Solderable terminals for both power and signal connections

Applications

Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control systems

Procurement Notes

Verify component authenticity through authorized Microchip Technology distributors. Confirm package integrity and terminal condition upon receipt. Ensure proper electrostatic discharge handling procedures are followed during storage and installation. Cross-reference datasheet revisions to ensure compatibility with specific application requirements.

Selection Notes

Select this module for applications requiring high-frequency operation up to 20 kHz. Evaluate thermal management capabilities based on the specified junction-to-case thermal resistance values. Consider the pulsed collector current rating for transient load conditions. Verify gate drive voltage compatibility with the ±20 V maximum rating.

Part Context

This component belongs to the Microsemi SP1 series of isolated power modules. It integrates a single IGBT switch and one anti-parallel diode into a compact footprint designed for direct heatsink mounting. The series emphasizes high integration levels and robust performance in demanding power electronics environments.