APTGT300A60TG

$104.45

Description：IGBT MODULE 600V 430A 935W SP4
Series：-

SKU:3ba6259e0e41 Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 600V 430A 935W SP4
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Half Bridge
Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 300A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP4
Supplier Device Package：SP4
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：430 A
Power - Max：935 W
Current - Collector Cutoff (Max)：350 µA
Input Capacitance (Cies) @ Vce：18.4 nF @ 25 V

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APTGT300A60TG

Overview

The APTGT300A60TG is a silicon IGBT module manufactured by Microchip Technology, housed in an SP4 package. It features a dual configuration with a maximum collector-emitter voltage of 600 V and a continuous collector current of 430 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.4 V and a power dissipation rating of 935 W. It operates within a temperature range of -40°C to +100°C, utilizes screw mount installation, and has a maximum gate-emitter voltage of 20 V.

Feature Summary

Dual IGBT configuration for high-current applications
Low saturation voltage for efficient power conversion
Robust thermal management with specified power dissipation
Screw mount design for secure mechanical integration

Applications

Industrial motor drives
Inverter systems
Power supply units

Procurement Notes

Verify the specific datasheet version and electrical characteristics against official Microchip documentation before procurement. Confirm that the SP4 package dimensions and pinout match the target PCB layout or heatsink interface requirements. Ensure the operating environment stays within the specified temperature limits to maintain reliability and performance standards.

Selection Notes

Select this component when a 600V dual IGBT module with 430A current capacity is required. Consider the SP4 package size and screw mounting style for mechanical compatibility. Evaluate the 935W power dissipation against the thermal management solution available in the final assembly to ensure safe operating temperatures are maintained under load conditions.

Part Context

This part belongs to the APTGT series of high-speed IGBT modules from Microchip Technology. These modules are designed for demanding power electronics applications requiring high efficiency and reliability. The series typically offers optimized switching characteristics and low conduction losses compared to previous generations.