APTGT300SK170G

$171.63

Description：IGBT MODULE 1700V 400A 1660W SP6
Series：-

SKU:71f125367054 Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 1700V 400A 1660W SP6
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Single
Vce(on) (Max) @ Vge, Ic：2.4V @ 15V, 300A
Input：Standard
NTC Thermistor：No
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP6
Supplier Device Package：SP6
Voltage - Collector Emitter Breakdown (Max)：1700 V
Current - Collector (Ic) (Max)：400 A
Power - Max：1660 W
Current - Collector Cutoff (Max)：750 µA
Input Capacitance (Cies) @ Vce：26.5 nF @ 25 V

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APTGT300SK170G

Overview

The Microchip Technology APTGT300SK170G is a single-configuration silicon IGBT power module housed in an SP6 screw-mount package. It features a maximum collector-emitter voltage of 1.7 kV and a continuous collector current of 400 A at 25°C. The device exhibits a collector-emitter saturation voltage of 2 V and a gate-emitter leakage current of 600 nA. Maximum power dissipation is rated at 1.66 kW, with a maximum gate-emitter voltage of 20 V. The operational temperature range spans from -40°C to +100°C, and the unit weighs approximately 110 g.

Feature Summary

Single IGBT configuration for high-voltage switching applications
SP6 screw-mount packaging for robust mechanical integration
Silicon-based construction optimized for industrial power conversion

Applications

Industrial motor drives
Uninterruptible power supplies
High-power inverters

Procurement Notes

Verify component authenticity through authorized Microchip Technology distributors or certified suppliers. Confirm RoHS compliance status via official documentation before procurement. Ensure storage conditions align with manufacturer specifications to maintain device integrity during handling and installation phases.

Selection Notes

Select this module for applications requiring 1.7 kV blocking capability and 400 A continuous current handling. Verify thermal management requirements against the 1.66 kW power dissipation rating. Ensure the SP6 package dimensions and screw-mount interface match the system design constraints.

Part Context

This component belongs to the Microchip APTGT series of IGBT modules, designed for medium to high-power industrial applications. The SP6 package provides a standardized form factor for mounting on heatsinks, facilitating efficient thermal transfer in constrained electrical enclosures.

Replacement Considerations

Direct replacements include APTGT300DA170G, which shares identical electrical ratings and SP6 packaging. Verify pinout compatibility and thermal characteristics when substituting within existing circuit designs.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.