ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IGBT MODULE 1200V 580A 2100W D3
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：2.1V @ 15V, 400A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：D-3 Module
- Supplier Device Package：D3
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：580 A
- Power - Max：2100 W
- Current - Collector Cutoff (Max)：750 µA
- Input Capacitance (Cies) @ Vce：29 nF @ 25 V
Download product information
Overview
The APTGT400A120D3G is a single IGBT module manufactured by Microchip Technology, utilizing silicon technology. It features a maximum collector-emitter voltage of 600 V and a continuous collector current of 500 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.5 V and a gate-emitter leakage current of 400 nA. Rated for a power dissipation of 1.25 kW, it operates within a temperature range of -40°C to +125°C. The component is housed in a D3-11 package with screw mount installation style and a maximum gate-emitter voltage of 20 V.
Feature Summary
- Single configuration IGBT module designed for high-power applications
- Utilizes trench field-stop technology for optimized switching performance
- Robust thermal management capabilities with specified power dissipation rating
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the specific part number against official Microchip Technology documentation to ensure compatibility with system requirements. Confirm that the D3-11 package dimensions and screw mounting specifications align with the intended heatsink design. Check for any recent product change notices or lifecycle status updates directly from the manufacturer before finalizing procurement plans.
Selection Notes
Select this component based on its 600 V blocking capability and 500 A current handling capacity. Ensure the application environment remains within the specified -40°C to +125°C operating temperature range. Verify that the gate drive circuitry supports the required 20 V maximum gate-emitter voltage limit to prevent device damage during operation.
Part Context
This module belongs to the APTGT series of IGBT modules from Microchip Technology. It is part of a family of power semiconductor devices designed for efficient energy conversion. The D3-11 packaging standard facilitates integration into various industrial power electronics architectures requiring reliable high-current switching.
Replacement Considerations
Consult official Microchip Technology substitution guides for verified alternative part numbers. Ensure any replacement maintains identical electrical ratings, package footprint, and thermal characteristics to guarantee system compatibility without redesign.
