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Product Detailed Parameters
- Description：IGBT MODULE 1200V 560A 1785W SP6
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Dual, Common Source
- Vce(on) (Max) @ Vge, Ic：2.1V @ 15V, 400A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP6
- Supplier Device Package：SP6
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：560 A
- Power - Max：1785 W
- Current - Collector Cutoff (Max)：750 µA
- Input Capacitance (Cies) @ Vce：28 nF @ 25 V
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Overview
The APTGT400DU120G is a trench field-stop IGBT power module manufactured by Microchip Technology. It features a dual common-source configuration housed in an SP6 screw-mount package. The device supports a maximum collector-emitter voltage of 1200 V and a continuous collector current of 560 A at 25°C. Maximum power dissipation is rated at 1785 W, with a typical saturated collector-emitter voltage of 1.7 V. Operating temperatures range from -40°C to +100°C junction temperature.
Feature Summary
- Trench field-stop IGBT technology for optimized switching performance
- Dual common-source configuration for bridge leg applications
- SP6 screw-mount package design for robust mechanical connection
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- High-frequency induction heating
Procurement Notes
Verify the specific ordering suffix and revision level against the manufacturer's latest datasheet before procurement. Confirm that the SP6 package dimensions match the intended heatsink interface. Ensure gate drive requirements align with the specified maximum ratings to prevent device damage during operation.
Selection Notes
Select this component when high current handling up to 560 A is required within a 1200 V system. The SP6 package offers a balance of thermal performance and mounting simplicity. Evaluate thermal resistance values against the application's cooling strategy to ensure junction temperatures remain within the specified operational limits under peak load conditions.
Part Context
This module belongs to the APTGT series of high-voltage IGBT modules. It utilizes silicon technology and is designed for demanding power conversion environments. The product line emphasizes reliability and efficiency in industrial power electronics applications requiring robust semiconductor solutions.
Replacement Considerations
Direct replacements must match the 1200V/560A rating and SP6 footprint. Verify pinout compatibility and thermal characteristics. Consult official substitution lists for equivalent trench field-stop devices with similar electrical parameters.
