APTGT50DU120TG

$64.59

Description：IGBT MODULE 1200V 75A 277W SP4
Series：-

SKU:6ea3b9223ecd Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 1200V 75A 277W SP4
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Dual, Common Source
Vce(on) (Max) @ Vge, Ic：2.1V @ 15V, 50A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP4
Supplier Device Package：SP4
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：75 A
Power - Max：277 W
Current - Collector Cutoff (Max)：250 µA
Input Capacitance (Cies) @ Vce：3.6 nF @ 25 V

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APTGT50DU120TG

Overview

The APTGT50DU120TG is a single IGBT module manufactured by Microchip Technology, utilizing silicon technology in an SP4 package. It features a maximum collector-emitter voltage of 1.2 kV and a continuous collector current of 75 A at 25°C. The device has a collector-emitter saturation voltage of 1.7 V and a power dissipation rating of 277 W. Gate-emitter leakage current is specified at 400 nA, with a maximum gate-emitter voltage of 20 V. Operating temperatures range from -40°C to +100°C. The unit weighs 110 g and supports screw mount installation.

Feature Summary

Trench Field Stop dual IGBT technology for robust switching performance
Common source configuration within the SP4 chassis mount package
High thermal stability suitable for demanding industrial environments

Applications

Industrial motor drives
Power inversion systems
Medium frequency switching applications

Procurement Notes

Verify component authenticity through authorized Microchip Technology distributors or direct channels. Confirm RoHS compliance status via official documentation before integration. Ensure storage conditions align with manufacturer specifications to maintain reliability. Cross-reference datasheet revisions to guarantee compatibility with existing design parameters. Validate thermal management requirements against the specified power dissipation limits.

Selection Notes

Select this module for applications requiring high voltage isolation and significant current handling capabilities. The SP4 package facilitates efficient heat dissipation for chassis mounting configurations. Consider the 1.2 kV rating for medium voltage systems where standard low-voltage components are insufficient. Evaluate thermal resistance characteristics to ensure adequate cooling solutions are implemented for sustained operation at rated currents.

Part Context

This component belongs to the Microchip Technology IGBT modules category, specifically designed for high-power industrial use. It represents a Trench Field Stop architecture, offering improved switching efficiency compared to older technologies. The SP4 packaging standard ensures mechanical compatibility with common heatsink interfaces used in power electronics assemblies.