ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IGBT MODULE 600V 80A 176W SP3
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Full Bridge Inverter
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 50A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP3
- Supplier Device Package：SP3
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：80 A
- Power - Max：176 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：3.15 nF @ 25 V
Download product information
Overview
The APTGT50H60T3G is a silicon IGBT module manufactured by Microchip Technology, housed in an SP3-32 screw-mount package. It features a full bridge configuration with a maximum collector-emitter voltage of 600 V and a continuous collector current of 80 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.5 V and a power dissipation rating of 176 W. Operating within a temperature range of -40°C to +100°C, it includes a gate-emitter leakage current of 600 nA and a maximum gate-emitter voltage of 20 V.
Feature Summary
- Utilizes trench field-stop IGBT technology for efficient power conversion.
- Integrates a full bridge inverter configuration within a single compact module.
- Includes a built-in NTC thermistor for precise thermal monitoring.
Applications
- Single-phase bridge rectifier circuits
- Industrial motor drive systems
- Uninterruptible power supply (UPS) units
Procurement Notes
Verify the specific suffix T3G against official Microchip documentation to confirm pinout compatibility and internal component specifications. Ensure that the SP3-32 package dimensions align with the target heatsink interface before integration. Cross-reference the latest datasheet revision to confirm RoHS compliance status and any recent product change notifications affecting performance characteristics.
Selection Notes
Select this module for applications requiring a 600 V rating and 80 A continuous current capability in a full bridge topology. The SP3-32 package offers a balance of thermal performance and mounting simplicity via screw installation. Consider the 1.5 V saturation voltage for conduction loss calculations and ensure the cooling system can handle the 176 W power dissipation rating under worst-case operating conditions.
Part Context
This component belongs to the APTGT50 series of trench field-stop IGBT modules from Microchip Technology. It shares the same electrical ratings as variants like APTGT50H60RT3G but differs in packaging and internal configuration details. The series is designed for high-efficiency power switching applications where reliable operation at 600 V is required.
Replacement Considerations
APTGT50H60RT3G is a related variant within the same series. Verify if the RT3G suffix indicates a different internal configuration or packaging requirement compared to the T3G version before substitution.
