SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The APTGT50SK170T1G is a single IGBT power module manufactured by Microchip Technology, utilizing silicon trench field-stop technology. It features a maximum collector-emitter voltage (VCEO) of 1.7 kV and a continuous collector current of 75 A at 25°C. The saturation voltage (VCE(sat)) is specified at 2 V. The module supports a maximum power dissipation of 312 W and operates within a junction temperature range of -40°C to +100°C. Key electrical parameters include a gate-emitter leakage current of 400 nA and a maximum gate-emitter voltage of ±20 V. It employs screw mount installation in the SP4 package.
Verify the specific suffix T1G against official Microchip documentation to confirm pinout and packaging details. Ensure compatibility with existing thermal management solutions given the 312 W dissipation rating. Confirm RoHS compliance status through the manufacturer's latest datasheet or product change notifications before finalizing procurement plans.
Select this component for applications requiring a 1.7 kV rated single IGBT with moderate current handling capabilities. Compare the 75 A continuous current rating against peak load requirements. Evaluate the SP4 package dimensions for mechanical fit. Consider the 2 V saturation voltage impact on conduction losses relative to alternative modules in the same voltage class.
This part belongs to the Microchip APTGT series of IGBT modules, which are based on trench field-stop technology. The series offers various configurations including single, dual, and bridge modules. The APTGT50SK170T1G specifically targets high-voltage applications where reliability and efficiency are critical, leveraging Microchip's expertise in power semiconductor manufacturing.
Direct substitutes may include other 1.7 kV single IGBT modules from Microchip or competitors with similar current ratings and package types. Verify pin-to-pin compatibility and thermal characteristics. Cross-reference with the APTGT50SK170TG if the suffix difference denotes a specific packaging or revision change confirmed by the manufacturer.