SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The APTGT75A1202G is a single IGBT power module manufactured by Microsemi Corporation. It features a Non-Punch-Through (NPT) field-stop technology design, optimized for high-voltage applications up to 1200V. The module provides a continuous collector current of 110A at 25°C and supports a maximum power dissipation of 357W. Packaged in the SP2 form factor, it includes an integrated NTC thermistor for thermal monitoring. The device operates within a junction temperature range of -40°C to 150°C and utilizes screw mount installation for secure mechanical attachment.
Verify the specific suffix '2G' against official Microsemi documentation to confirm exact pinout and electrical characteristics, as suffixes often denote specific packaging or testing variations. Ensure compatibility with SP2 mounting hardware. Confirm availability status through authorized distributors, as this component may be subject to lifecycle changes or discontinuation notices from the manufacturer.
Select this module for applications requiring 1200V blocking voltage and 110A continuous current handling. The SP2 package offers a balance of thermal performance and footprint efficiency. Consider the integrated NTC thermistor if active thermal monitoring is required. Evaluate switching frequency requirements against the device's turn-on/turn-off times to ensure optimal efficiency in the target circuit topology.
This component belongs to Microsemi's APTGT series of IGBT modules, which are designed for medium-power industrial and commercial applications. The series leverages trench gate field-stop technology to minimize switching losses while maintaining high ruggedness. The APTGT75A1202G specifically targets non-isolated bridge configurations in power electronics where reliability under high thermal stress is critical.
Direct replacements include the APTGT75A120T1G, which shares similar electrical ratings but may differ in package details or suffix specifications. Verify pin-to-pin compatibility and thermal resistance values before substitution. Cross-reference with the latest Microsemi product selection guide to ensure functional equivalence in the specific application environment.