APTGT75H60T3G

APTGT75H60T3G

$55.92
  • Description:IGBT MODULE 600V 100A 250W SP3
  • Series:-

SKU:a7c5f0d76351 Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT MODULE 600V 100A 250W SP3
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:Trench Field Stop
  • Configuration:Full Bridge Inverter
  • Vce(on) (Max) @ Vge, Ic:1.9V @ 15V, 75A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:SP3
  • Supplier Device Package:SP3
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):100 A
  • Power - Max:250 W
  • Current - Collector Cutoff (Max):250 µA
  • Input Capacitance (Cies) @ Vce:4.62 nF @ 25 V

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APTGT75H60T3G

Overview

The APTGT75H60T3G is a silicon IGBT module manufactured by Microchip Technology, housed in an SP3-32 package. It features a full bridge configuration with a maximum collector-emitter voltage of 600 V and a continuous collector current of 100 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.5 V and a gate-emitter leakage current of 600 nA. Power dissipation is rated at 250 W, with a maximum gate-emitter voltage of 20 V. Operating temperatures range from -40°C to +100°C, and it utilizes screw mount installation.

Feature Summary

  • Full bridge configuration for power conversion applications
  • Trench field-stop technology for efficient switching
  • Screw mount installation for secure thermal management

Applications

  • Industrial motor drives
  • Uninterruptible power supplies
  • Inverter circuits

Procurement Notes

Verify the specific revision suffix and manufacturing date code against the latest Microchip Technology datasheet before procurement. Confirm that the SP3-32 package dimensions match the target PCB layout and heatsink interface requirements. Ensure compliance with RoHS directives as specified in the official documentation.

Selection Notes

Select this component when a 600 V full bridge topology is required with 100 A continuous current capability. Consider the 250 W power dissipation rating and the -40°C to +100°C operating temperature range for thermal design. Verify compatibility with standard screw mounting techniques and appropriate gate drive voltages within the 20 V limit.

Part Context

This part belongs to the Microchip Technology APTGT series of IGBT modules, which utilize trench field-stop technology. The series offers various configurations including single, half-bridge, and full bridge options in standardized packages like SP3. These modules are designed for robust performance in medium-power industrial applications requiring reliable switching characteristics.

Replacement Considerations

Consult Microchip Technology's official cross-reference guides or distributor databases for verified substitute part numbers. Ensure any replacement maintains identical voltage, current, and package specifications.

APTGT75H60T3GAPTGT75H60T3G
$55.92
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