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Product Detailed Parameters
- Description：PM-IGBT-TFS-SP3F
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：-
- Configuration：Full Bridge
- Vce(on) (Max) @ Vge, Ic：1.8V @ 15V, 100A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：155 A
- Power - Max：416 W
- Current - Collector Cutoff (Max)：15 µA
- Input Capacitance (Cies) @ Vce：20000 pF @ 25 V
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Overview
The Microchip Technology APTGX100H120T3G is a silicon-based IGBT module utilizing Trench 7 technology in a full bridge configuration. It features a collector-emitter voltage of 1200 V and a continuous collector current of 155 A at 25°C. The saturation voltage is specified as 1.55 V to 1.8 V, with power dissipation rated at 416 W. The device operates within a temperature range of -40°C to +100°C and uses an SP3F package for chassis mounting.
Feature Summary
- Integrates Trench 7 IGBT technology for optimized switching performance
- Includes built-in NTC thermistor for thermal monitoring
- Designed for high-voltage applications up to 1200 V
Applications
- Industrial motor drives
- Power conversion systems
- Inverter circuits
Procurement Notes
Verify the specific datasheet version and mechanical drawing compatibility before integration. Confirm that the SP3F package dimensions match the intended chassis design. Ensure gate drive requirements align with the specified leakage currents and voltage limits. Check for any recent product change notices regarding material composition or testing standards.
Selection Notes
Select this component when a full bridge topology is required for high-power applications. The 1200 V rating suits medium-voltage industrial environments. Consider the 416 W dissipation capability for thermal management planning. The integrated NTC sensor simplifies temperature feedback loops compared to discrete solutions.
Part Context
This module belongs to Microchip's PM-IGBT-TFS-SP3F series. It complements other variants like APTGT100A120T3AG by offering a complete bridge configuration rather than dual switches. The SP3F package provides a standardized form factor for consistent board layout across different current ratings within the same family.
Replacement Considerations
Direct substitutes include other SP3F full bridge modules from Microchip such as APTGX75H120T3G if lower current is acceptable. Cross-brand replacements require careful verification of pinout compatibility and thermal resistance characteristics.
