APTGX300H120G

Overview

The APTGX300H120G is a silicon IGBT power module manufactured by Microchip Technology. It features a full bridge configuration within an SP6C package, designed for screw mounting. The device supports a maximum collector-emitter voltage of 1.2 kV and delivers a continuous collector current of 280 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 1.8 V, a gate-emitter leakage current of 150 nA, and a power dissipation rating of 682 W. The module operates reliably across a temperature range from -40°C to +125°C, with a maximum gate-emitter voltage limit of ±20 V.

Feature Summary

• Full bridge topology integrates multiple switching elements into a single compact unit
• SP6C packaging provides standardized mechanical dimensions for reliable thermal management
• High-temperature operation capability ensures stability in demanding environments

Applications

• Industrial motor drives requiring high-voltage isolation
• Uninterruptible power supply systems
• High-frequency inverter circuits

Procurement Notes

Verify the specific revision level and manufacturing date code upon receipt to ensure compliance with project specifications. Confirm that the SP6C package dimensions match the intended heatsink interface. Check for any physical damage to the terminal pins before installation. Ensure proper electrostatic discharge precautions are followed during handling and assembly processes.

Selection Notes

Select this component when a full bridge configuration is required for 1.2 kV applications. The 280 A current rating suits moderate-to-high power density designs. Verify that the system can accommodate the 682 W power dissipation through adequate cooling solutions. Consider the ±20 V gate drive requirements for compatible controller integration.

Part Context

This module belongs to Microchip's high-speed IGBT4 power module family, optimized for efficiency in medium-power conversion tasks. The SP6C form factor allows compatibility with existing industrial footprints while offering improved thermal performance compared to older discrete solutions.

Replacement Considerations

Direct substitutes may include other Microchip SP6C full bridge modules with similar voltage and current ratings, such as the APTGLQ300H65G for lower voltage applications or the APTGX200H120G for reduced current needs. Always verify pinout compatibility and thermal characteristics before substitution.