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Product Detailed Parameters
- Description：PM-IGBT-TFS-SP3F
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：-
- Configuration：Three Phase
- Vce(on) (Max) @ Vge, Ic：1.8V @ 15V, 50A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：108 A
- Power - Max：377 W
- Current - Collector Cutoff (Max)：10 µA
- Input Capacitance (Cies) @ Vce：11100 pF @ 25 V
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Overview
The APTGX50TA120T3AG is a silicon-based IGBT power module manufactured by Microchip Technology. It features a triple phase leg configuration housed in an SP3F package with screw mount installation. The device supports a collector-emitter voltage of 1200V and delivers a continuous current of 108A. Key electrical parameters include a saturation voltage of 1.55V, power dissipation of 377W, and a junction temperature range from -40°C to +175°C.
Feature Summary
- Triple phase leg topology for three-phase power conversion applications
- High-temperature silicon trench IGBT technology
- Integrated NTC thermistor for thermal monitoring
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Inverter systems
Procurement Notes
Verify the specific datasheet revision and application notes provided by Microchip Technology before integration. Confirm that the SP3F package dimensions and terminal layout match the target heatsink design. Ensure gate drive circuits are compatible with the required voltage levels and switching characteristics specified in the official documentation.
Selection Notes
Select this component when a robust three-phase solution is required with high thermal tolerance. The 1200V rating suits medium-voltage industrial environments. Consider the 108A continuous current capability against peak load requirements. The integrated NTC sensor simplifies thermal management compared to modules without internal sensing.
Part Context
This module belongs to Microchip's IGBT product line, utilizing trench field-stop technology. It is designed for high-efficiency power switching in demanding industrial applications. The SP3F packaging standardizes mechanical mounting across similar voltage ratings within the manufacturer's portfolio.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Cross-referencing requires direct consultation of Microchip Technology's official replacement guides or authorized distributor databases.
