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Product Detailed Parameters
- Description：MOSFET 6N-CH 100V 139A SP6-P
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：6 N-Channel (3-Phase Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：100V
- Current - Continuous Drain (Id) @ 25°C：139A
- Rds On (Max) @ Id, Vgs：10mOhm @ 69.5A, 10V
- Vgs(th) (Max) @ Id：4V @ 2.5mA
- Gate Charge (Qg) (Max) @ Vgs：350nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：9875pF @ 25V
- Power - Max：390W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP6
- Supplier Device Package：SP6-P
- Grade：-
- Qualification：-
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Overview
The APTM10TAM09FPG is a six-channel N-channel MOSFET array manufactured by Microchip Technology, designed for high-power applications. It features a 100V drain-source voltage rating and supports a continuous drain current of 139A at 25°C. The device integrates three phases in a single package with a maximum power dissipation of 390W. Key electrical parameters include a gate charge of 350nC at 10V, an input capacitance of 9875pF at 25V, and a threshold voltage of 4V at 2.5mA. The on-resistance is specified as 10mΩ at 69.5A and 10V. It operates within a junction temperature range of -40°C to 150°C and utilizes the SP6-P base-mounted package.
Feature Summary
- Six-channel N-channel configuration arranged for three-phase bridge applications
- High thermal performance capability with 390W maximum power dissipation
- Robust switching characteristics with low gate charge and defined on-resistance
- Base-mount installation design for efficient heat transfer
Applications
- Three-phase motor drive systems
- Industrial power conversion circuits
- Inverter topologies requiring integrated phase legs
Procurement Notes
Verify the specific suffix FPG against the manufacturer datasheet to confirm pinout and internal configuration matches system requirements. Ensure the SP6-P package footprint aligns with PCB layout constraints. Confirm RoHS compliance status if environmental regulations apply to the final assembly. Cross-reference the thermal resistance values from the official document for heatsink design calculations.
Selection Notes
Select this component when a compact solution for three-phase control is required without discrete transistor matching. The integrated array simplifies layout and reduces parasitic inductance compared to individual devices. Evaluate the 100V rating against peak bus voltages to ensure adequate headroom. Consider the 139A current capacity relative to load requirements and ambient cooling conditions.
Part Context
This part belongs to the APTM10 series of power modules from Microchip Technology. These modules are engineered for robust operation in demanding industrial environments. The SP6-P package provides a standardized mounting interface for high-current applications. The series focuses on integrating multiple switches to improve system density and reliability.
Replacement Considerations
Consult the official Microchip replacement guide or datasheet revision history for confirmed substitute part numbers. Verify that any alternative maintains identical pin compatibility and electrical ratings.
