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Product Detailed Parameters
- Description：MOSFET 6N-CH 1200V 78A SP6-P
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Technology：Silicon Carbide (SiC)
- Configuration：6 N-Channel (3-Phase Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C：78A (Tc)
- Rds On (Max) @ Id, Vgs：33mOhm @ 60A, 20V
- Vgs(th) (Max) @ Id：2.2V @ 3mA (Typ)
- Gate Charge (Qg) (Max) @ Vgs：148nC @ 20V
- Input Capacitance (Ciss) (Max) @ Vds：2850pF @ 1000V
- Power - Max：370W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP6
- Supplier Device Package：SP6-P
- Grade：-
- Qualification：-
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Overview
The APTMC120TAM33CTPAG is a discrete semiconductor module manufactured by Microchip Technology, utilizing Silicon Carbide (SiC) technology. It features a 6 N-Channel configuration designed for three-phase bridge applications. The device is rated for a drain-to-source voltage of 1200V and supports a continuous drain current of 78A at case temperature. Packaged in the SP6-P format, it is intended for high-power switching environments requiring robust thermal performance.
Feature Summary
- Utilizes Silicon Carbide (SiC) material for enhanced thermal efficiency and high-temperature operation capabilities.
- Integrates six N-channel MOSFETs within a single module to facilitate three-phase bridge circuit implementations.
- Designed with a base-mount package structure to support direct thermal management solutions.
Applications
- Three-phase motor drive systems
- Industrial power conversion equipment
- High-efficiency inverter architectures
Procurement Notes
Verify component authenticity through authorized distribution channels. Confirm RoHS compliance status and check for recent Product Change Notifications or End-of-Life notices from Microchip Technology prior to finalizing procurement decisions.
Selection Notes
Select this module when designing systems requiring 1200V blocking capability and moderate current handling up to 78A. Ensure the application layout accommodates the SP6-P package dimensions and provides adequate heatsinking for the specified thermal dissipation requirements.
Part Context
This component belongs to Microchip's discrete semiconductor module portfolio focused on wide-bandgap technologies. It serves as a specialized solution for power electronics designers seeking reliable SiC-based switching elements for industrial and automotive-grade applications.
Replacement Considerations
Consult official Microchip documentation for verified substitute part numbers. Cross-reference electrical parameters and pinout configurations carefully before implementing any alternative components in existing designs.
